Deposition MRT Series
Contribute to the magnetic properties improvement on the magnetic devices in various situations

MRT series provides optimum magnetic annealing process for a wide variety of magnetic devices such as Magnetoresistive random-access memory (MRAM), HDD heads, magneto-sensors for smart power, smartphone, automobile and other applications. Due to the increasing demand for fast, low power consuming and nonvolatile memory devices, the global market for MRAM will grow in the future. In particular, perpendicular magnetic tunnel junction (P-MTJ) MRAM is highly expected as next generation memory for high performance computing and other emerging applications. The system’s unique thermal processing technology in a uniform magnetic field realizes excellent film thickness distribution and enhanced magneto-characteristics of each device.
MRT300 is a fully automated high-magnetic-field annealing system for 300mm wafers which suitable for R&D, prototype manufacturing, small volume production. The system provides variable magnetic field (up to five Tesla), 25 wafers in a batch, and strengthens the temperature control up to 550 degrees C plus or minus 1 degree, with high throughput rapid ramp over technology. Furthermore, applying wide range of magnetic field angle processes (in-plane, out of plane) by some parameter control of recipe management software, it allows repeatable temperature control without any hardware changes.
MRT5000 is a fully automated high-magnetic-field annealing system for 150mm and 200mm wafers. The system provides variable magnetic field (up to five Tesla), 25 wafers in a batch, strengthen the temperature control up to 550 degrees plus or minus 1 degree, with high throughput oven technology. Differential cooling of two chambers within the oven achieves fast thermal cool-down under high vacuum or inert gas conditions, providing shorter processing time and increased throughput. Combined high throughput oven technology with safety-conscious superconducting magnet design, it has achieved unsurpassed wafer throughput and tool up-time. This has established the MRT5000 as the production standard for high field magnetic annealing of thin film heads.
MRT200 is a modular platform for magnetic annealing of 150mm and 200mm wafer size with magnetic fields up to 0.2 Tesla and at temperatures up to 400 degree C. The tool incorporates a magnet design that minimizes the stray magnetic field of the tool, allowing the installation of multiple tools in close proximity for volume production. The tool can be supplied with a single process module or can be configured with multiple process modules. Product can be manually or automatically loaded, with a single wafer handling robot addressing the process modules. This design provides high wafer throughput in a compact package, incorporating unrivalled process flexibility and reliability.
MATr is a magnetic annealing system, enabling to process various substrates to a maximum of 200mm wafer size. The system provides up to 2 Tesla variable magnetic field and capable of ten wafers in a batch. The optimized shielding design allows the space efficient, compact system which suitable for the research or laboratory use. The system configuration/option is selectable for individual customer’s needs.
MATrSM is a Setting Magnet system which provides up to 3 Tesla Magnetic Field and auto-sample handling. The system is capable of handling various samples such as wafer/HGA/Media Platter, etc. The system is operated by SEMI Standard software and configures touch-screen, barcode reader, data/event logging, recipe management and multi-level security access function.
Product comparison
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Wafer size (mm) |
300 | 100,150,200,300 | 100,150,200 | 100,150,200 | 100,150,200 |
Availability | New | New | New | New | New |
Production load max | 10/25: in-plane/perpendicular | 25 | 25 | 10 | Customized |
Throughput (Based on 2 hours @soak temp) |
6.25wph with perpendicular anneal, 2.5wph with in-plane anneal |
6.25wph @200 or less, 2.5wph @300 |
6.25wph @200 or less | 4wph @200 or less | Customized to reqirements |
Process | Magnetic anneal | Magnetic anneal | Magnetic anneal | Magnetic anneal | Magnetic field direction setting |
Substrates | Si | Si, AlTiC | Si, AlTiC | Si, AlTiC | Slider assemblies |
Safety | S2/S8, CE, NFPA 79 | S2/S8, CE, NFPA 79 | S2/S8, CE, NFPA 79 | S2/S8, CE, NFPA 79 | S2/S8, CE, NFPA 79 |
Additional features | Cryogen free magnet, Transverse & perpendicular anneal, Small footprint |
Cryogen free magnet, Transverse & perpendicular anneal, Small footprint Bridge tool |
Cryogen free magnet, Transverse anneal, Small footprint Bridge tool |
Cryogen free magnet, Transverse & perpendicular anneal, Small footprint, Bridge tool |
Cryogen free magnet, High throughput |