Etch Episode™ UL Series
Introducing industry-leading platform flexibility for up to 12-chamber configuration
Launched in 2020, the Episode™ UL series of etch systems can be configured flexibly with up to 12 chambers. Featuring reductions in footprint, ease of maintenance, and TEL’s proprietary smart tool technology, Episode™ UL significantly boosts customers’ fab productivity. Its combination of excellent process performance and high productivity supports diversifying functions of semiconductor devices and accelerates their evolution.
Designed to boost TEL customers’ fab productivity, Episode™ UL offers many advantages including flexible multi-chamber configurations, significant saving in footprint, ease of maintenance, and advanced Smart tool features.
TEL is the pioneer of space-saving systems with a rectangular cluster design, in which processing chambers are arranged in two horizontally opposed rows. Episode™ UL can flexibly accommodate between 4 and 12 chambers to maximize loading capacity based on customer fab layouts. With a maximum 12 chambers configuration, the new platform’s horizontally opposed cluster design offers significant reduction in footprint per chamber for both cleanroom and utility areas. Episode™ UL also has a larger space for easier maintenance than that of its predecessors, ensuring greater ease of maintenance. Its transfer system and process modules are equipped with a number of sensors and high-speed control systems, enabling autonomous process control via big data analytics powered by TEL’s proprietary smart tool technology.
Episode™ UL offers higher process performance and extendability to drive the evolution of the latest logic and memory devices.
Please use the following link to watch promotion video of TEL Episode™ UL.
URL: https://youtu.be/wHeXV70whAs
Flexible Layout
Space Saving
Smart Tool
Product comparison
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| Wafer size (mm) |
300 | 300 | 300 |
| Availability | New | New | New |
| Number of chambers | 1-12 | 1-6 | 1-6 |
| Application | Dielectric, Conductor, Reactive Ion Etch |
Dielectric, Conductor, Reactive Ion Etch |
Dielectric, Chemical Dry Etch |
| Substrates | Si | Si | Si |
| Safety | S2, CE | S2, CE | S2, CE |
Episode, Tactras, Certas and Certas LEAGA are registered trademarks or trademarks of Tokyo Electron Group in Japan and/or other countries.
