Deposition Episode™Series

The Episode™ 1 platform integrates up to eight process modules and supports continuous execution of multiple processes, offering customers the ability to handle increasingly complex processes as device features continue to shrink. The platform can be configured with the OPTCURE™ module that removes the native oxide layer from silicon wafers and the ORTAS™ module for depositing titanium, both of which help reduce the contact resistance of metal interconnects in advanced logic devices. Aiming to reduce contact resistance even further, TEL is focusing on new materials and accelerating the development of suitable deposition processes.
The Episode™ 1 series of products come with enhanced equipment data collection and edge data processing systems. Combined with other features including an analytics application, Episode™ 1 can improve equipment availability and engineer efficiency. The data on equipment availability and energy use are integrated in a database, which can be used to help reduce the burden on the environment.

Episode™ 2 is a platform capable of simultaneously transferring two wafers. Combining high productivity and a reduced footprint, the system can significantly improve customers’ fab efficiency. The DMR (Duo matched reactor) module can simultaneously perform deposition on two wafers. Succeeding the Triase⁺™ EX-II™ series of products that have been widely adopted by memory device manufacturers, DMR also offers various new features for dealing with continued 3D device stacking and higher aspect ratios.^*
The Episode™ 2 series of products come with enhanced equipment data collection and edge data processing systems. Combined with other features including an analytics application, Episode™ 2 can improve equipment availability and engineer efficiency. The data on equipment availability and energy use are integrated in a database, which can be used to help reduce the burden on the environment.
^*Aspect ratio: The depth and width ratio of a patterned trench etched on a wafer