Cleaning ZETA™+ Series
Unique strip and clean capability in a flexible, economical, and production proven platform from the industry leader in batch spray wet processing.

The ZETA™+ spray clean system provides the most effective and flexible batch solution for stripping of photoresist and other films, as well as general clean. Its unique ViPR™+ technology offers the highest performance and lowest cost for resist, silicide and general film stripping needs. High temperature process of ViPR™+ enables rapid removal of various heavy dozed photoresists and other organic films which are the most difficult material to remove with minimum consumable costs and maximum throughput. Delivering efficiency well beyond that achieved by other single wafer clean systems on the market. Post etch clean for both front-end and back-end are also available, as are RCA clean and DHF wet etch. The ZETA™ series has a large number of customer install base across industry. The system is available as fully-automated solution for 300/200mm wafers and as a semi-auto solution for 150/200mm wafers.
* The ViPR™+ technology comes with the ZETA™+ series of systems.
Product comparison
ZETA and ViPR are registered trademarks or trademarks of TEL Manufacturing and Engineering of America, Inc. in US and/or other countries.