The WDF™ series is a fully automatic dicing frame prober capable of flexibly probing with standard wafers and devices on a dicing frame. In the semiconductor test market, various product forms such as thin wafers, advanced packages with TSV's, diced wafers, KGD application, strip frame devices require frame probing. The WDF™ series is an innovative probing technology that supports dicing frame transfer with no change kit. It realizes the same test as the wafer prober but with extremely thin wafers, strip frames, and devices after the dicing/singulation process.
