Products

CLEAN TRACK™ LITHIUS Pro™ AP

Coater/Developer

Coater/developer for 300/200mm wafers. The platform is optimized for the next-generation packaging and spin-on hard mask processes.

CLEAN TRACK™ LITHIUS Pro™ Z

Coater/Developer

Coater/developer for 300/200mm wafers. This is the latest platform that supports EUV and other advanced lithography processes with excellent reliability and productivity.

CLEAN TRACK™ LITHIUS Pro™ V / LITHIUS Pro™ V-i

Coater/Developer

Coater/developer for 300mm wafers. Building on the design concept of CLEAN TRACK™ LITHIUS Pro™, the systems deliver the highest throughput per day.

CLEAN TRACK™ LITHIUS Pro™ / LITHIUS Pro™ ｰi

Coater/Developer

Coater/developer for 300/200mm wafers. While achieving enhanced productivity and smaller footprint, the systems also realize their core concepts of improved OEE (Overall Equipment Efficiency) and lower CoO (Cost of Ownership).

CLEAN TRACK™ LITHIUS™ / LITHIUS™ i+

Coater/Developer

Coater/developer for 300/200mm wafers. The systems offer enhanced adaptability to critical process technologies with greater stability, while achieving shorter lead time, faster ramp-up, and greater ease of modification.

CLEAN TRACK™ ACT™12 / ACT™12 SOD

Coater/Developer
SOD Coater

Coater/developer for 300/200mm wafers that deliver improved uptime through enhanced reliability of the components. The spin-on dielectric (SOD) model can coat and cure diverse SOD materials.

CLEAN TRACK™ ACT™8Z

Coater/Developer

The coater/developer for 75-200mm wafers is capable of handling diverse substrates (including thin/thick substrates of Si, GaAs, GaN, SiC, etc.) as well as SOD coating.

CLEAN TRACK™ ACT™ M

Photomask Coater/Developer

Coater/developer for photomask. The system uses the CLEAN TRACK™ ACT™ platform to achieve excellent process performance and high reliability.

Episode™ UL

Plasma Etch System

Plasma etch system for 300mm wafers. The system offers flexible multi-chamber configurations, smaller footprint, greater ease of maintenance, and smart tool technology to boost customers' fab productivity.

Tactras™

Plasma Etch System

Plasma etch system for 300mm wafers. Since its release in 2006, the system has been offering consistently high reliability and productivity, attaining the world's top levels in wafer transfer speeds and footprint.

Certas LEAGA™

Gas Chemical Etch System

Gas chemical etch system for 300mm wafers. The environment-friendly and high-throughput system supports a wide range of applications including volume manufacturing and next-generation device development.

UNITY™ Me+

Plasma Etch System

Plasma etch system for 100-200mm wafers. The system delivers superior cost-performance ratio in production lines and has achieved excellent productivity and reliability.

CELLESTA™ -i MD

Single Wafer Cleaning System

Single-wafer cleaning system for 300mm wafers. Capable of implementing the latest processes involving 10nm technology node and beyond, the system powerfully supports the most advanced single-wafer cleaning environment.

CELLESTA™ -i

Single Wafer Cleaning System

Single-wafer cleaning system for 300mm wafers. Featuring enhanced productivity and much decreased footprint, the system requires significantly less clean room space compared with previous models.

CELLESTA™ MS2

Single Wafer Cleaning System

Physical cleaning system for 300mm single wafers. The system achieves high productivity and particle control through the capability to clean both wafer sides simultaneously up to the outermost wafer edge.

EXPEDIUS™ -i

Auto Wet Station

Batch cleaning system for 300mm wafers. Using the EXPEDIUS™ + auto wet station as the base model, the system has achieved further improvements in process performance and productivity.

NS300Z

Scrubber System

Scrubber system for 300mm wafers. Featuring process modules with proven reliability and stability, the system offers further productivity improvements.

NS300+ 200mm Conversion

Scrubber System

Scrubber system for 200/150mm wafers. Adopting the cleaning process technologies developed for next-generation 300mm devices, the system offers high reliability and productivity.

NS300+ HT

Scrubber System

Scrubber system for 300mm wafers. The system inherits and enhances the high reliability and stability of NS300+ to attain higher productivity.

NS300

Scrubber System

Scrubber system for 300mm wafers. The system offers high reliability and reduces damage to the wafer surface.

ANTARES™

Single Wafer Cryokinetic Cleaning System

Fully automated single-wafer cleaning system for 300mm wafers. The system's unique cryogenic aerosol technology removes particulates without using deionized water or chemicals, significantly improving the yield and enabling cleaning of hydrophobic films.

ZETA™＋200/300/Semi-auto

Batch Spray System

Fully automated batch spray cleaning system for 300/200mm wafers. The system accommodates FOUPs and SMIF pods that support a clean local environment (minienvironment) optimized for wafer transfers. A more cost-efficient semi-automated version is also available.

TELINDY PLUS™

Thermal processing system

Batch thermal processing system for 300mm wafers. Inheriting the high-volume capability of TELINDY™, the system offers enhanced performance by incorporating improvements and new technologies.

TELINDY PLUS™ IRad™

Plasma-Enhanced Batch Thermal ALD System

Batch thermal processing and deposition system for 300mm wafers. The innovative system integrates a plasma source unit with the highly productive and reliable TELINDY PLUS™ platform.

TELFORMULA™

Thermal processing system

Batch thermal processing system for 300mm wafers. Capable of a wide variety of applications, the system also incorporates innovative technologies to minimize the turnaround time from wafer start to wafer out.

ALPHA-8SE™ i

Thermal processing system

Batch thermal processing and deposition system for wafers up to 200mm. In addition to improved functionality and ease of operation for stable and continuous availability, the system features conformity with international safety standards.

NT333™

Atomic Layer Deposition System

TEL's first semi-batch ALD (atomic layer deposition) system for 300mm wafers. Employing original deposition technique, the system achieves excellent film thickness control and deposition as well as uniform film quality in high aspect ratio structures.

Triase⁺™ EX-II™ TiN

Single Wafer Deposition System

Single wafer deposition system for 300mm wafers. Using the ASFD process to enable high step coverage deposition, the system meets advanced device manufacturing needs while maintaining excellent productivity.

Triase⁺™ Ti/TiN

Single Wafer Deposition System

Single wafer CVD system for 300mm wafers. Using production-proven and highly reliable processes with TiCl₄, the system enables high step coverage deposition of Ti and TiN films.

Triase⁺™ W

Single Wafer Deposition System

Single wafer CVD system for 300mm wafers. The system supports high step coverage deposition of tungsten films using WF6 and performs low-resistance film deposition to meet further scaling needs.

Triase⁺™ SPAi

Single Wafer Plasma Treatment System

Single wafer deposition system for 300mm wafers. Using low-damage, low-temperature plasma processing, the system delivers high productivity and low environmental impact.

Episode™ 1

Single wafer Deposition System

Single-wafer deposition system for 300mm wafers. Equipped with up to 8 process modules, it can process multiple modules continuously.

Episode™ 2 DMR

Single wafer Deposition System

Single-wafer deposition equipment for 300mm wafers. Two wafers can be transported and coated simultaneously, increasing productivity and decreasing the footprint.

EXIM™

PVD System

PVD system for 300mm wafers featuring a unique deposition method. The process modules can be freely configured to meet customer needs, delivering excellent productivity and process performance.

LEXIA™-EX

PVD System

In addition to the deposition functions and scalability of its predecessor, maximum throughput is more than 20% higher, while the footprint is about 40% smaller and CO₂ emissions are 14% lower.

Cellcia™

Multi-Cell Test System

Next-generation wafer probing system for 300mm wafers. The multi-cell, multi-layer system structure maximizes the efficiency of testing, further reducing the total testing cost.

Prexa™

Wafer Prober

The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.

Prexa™MS

Wafer Prober

The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.

WDF™ 12DP+

Wafer/Dicing Frame Prober

The latest fully automated dicing frame prober. The system is capable of transferring and testing wafers and dicing frames without using a change kit to fulfill diverse customer needs.

Precio™ XL

Wafer Prober

Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.

Precio octo™

Wafer Prober

200mm wafer prober. The system adopts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE), markedly enhancing productivity.

PN-300

Data Management System for Wafer Prober

Wafer prober networking system using databases. It facilitates data access from other systems and enables users to freely edit and modify data.

Network-Based Prober Advanced Function

Operation Support System for Wafer Prober

Networking system developed for effective operation and maintenance of wafer probers. Remote operation helps staff reduction on the factory floor.

Synapse™ V / Synapse™ Z Plus

Wafer Bonder/Debonder

Bonding/debonding system that efficiently carries out temporary bonding and debonding of 300mm wafers. The system attains the highest level of total thickness variation (TTV) as well as high bonding accuracy.

Synapse™ Si

Wafer Bonder

Bonding system for devices on 300mm wafers. The system features alignment accuracy in the order of 3σ 0.1um or less, a smaller footprint, and high throughput.

Ulucus™ L

Wafer Edge Trimming

Laser edge trimming system for devices bonded on 300mm wafers. The system features improved productivity, reduced use of deionized water, and fewer process steps before and after trimming.

Ulucus™ LX

Extreme Laser
Lift Off
System

Extreme Laser Lift Off system for 300mm wafer bonding removes silicon substrates with laser beam irradiation, while reducing processes after wafer bonding and the amount of deionized water consumed. The system enables the reuse of wafers and increases the number of viable chips per wafer.

Ulucus™ G

Wafer Thinning System

Wafer thinning system for 300mm wafer fabrication. The system enables high-quality processing of both sides of wafers for realizing high flatness, clean, and low damage wafer fabrication by controlling the quality of each wafer.

Probus-SiC™

SiC Epitaxial CVD System

Epitaxial reactor to grow SiC on 150mm/200mm substrates used in SiC power semiconductor devices. Incorporating state-of-the-art technologies such as high temperature control under vacuum achieves excellent uniformity in thickness and dopant concentration.

UltraTrimmer Plus™

GCB system Corrective Etching/Trimming

Wafer trimmer that uses GCB (Gas Cluster Beam) to enable industry-leading trimming performance. The system reduces within-wafer non-uniformity, controls the amount to be trimmed, and supports surface modification including oxidation.

Acrevia™

GCB System for Dimension Modification/Corrective Etching

This wafer processing equipment combines the industry's highest level of trimming functionality using GCB (Gas Cluster Beam) with a high-precision scan system to achieve individual control of the amount of etching. It is also possible to improve LER (Line Edge Roughness) and reduce lithography defects that cause yield reduction.

Betelex™

FPD Etch/Ash System

Plasma etch/ash system for Gen 6 substrates. The system supports up to 5 optimal plasma sources to significantly improve productivity with an optimized footprint.

Impressio™

FPD Etch/Ash System

Plasma etch/ash system for Gen 6-10.5 substrates. The multi-chamber system supports up to 3 optimal plasma sources.

PICP™ / PICP™ Pro

FPD Etch/Ash System

Process chamber equipped with the world's first high-density plasma source originally developed by TEL. The chamber significantly improves process uniformity, and reduces power consumption by 20% or more through improved efficiency.