FPD Plasma Etch/Ash
Satisfying Customer’s Needs with Overwhelming Uniformity and Productivity
FPD Plasma Etch/Ash systems generate plasma in its vacuum chamber to etch thin-film and make electric circuits on large-area glass substrates. Our systems contribute to manufacturing liquid crystal displays (LCDs) or organic light-emitting diode displays (OLEDs) on Gen6/Gen8/Gen10.5 substrate. Since display devices get higher resolution and higher performance, FPD manufacturing increases complexity. In this background, FPD customers select TEL FPD Plasma Etch/Ash systems, which meet their requirements.
Betelex™ is a multi-chamber plasma etching and ashing system for 6-8 generation substrates. Today, to manufacture high-resolution and high-performance displays, the TFT process must become more complex, and higher productivity is required for plasma etch systems.
Betelex™ supports up to 5 process chambers and realize significantly higher productivity with smaller footprint and facility cost.
Betelex™ can also combine multi-process steps in separated chambers and contribute a sophisticated, up-to-date manufacturing process.
Betelex™ can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) or oxide semiconductor devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.
Features
Multi-chamber system: Maximum 5 chambers
Main Chamber mode: PICP™ mode
Main Substrate size:1,500mm x 1,850mm, 2,290mm x 2,620mm
Impressio™ is a multi-chamber Plasma Etch/Ash system supporting Gen 8-10.5 substrates for various applications, small/medium displays for smartphones, and large displays for TVs.
Impressio™ series can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) devices, oxide semiconductor devices, and amorphous silicon devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, silicon layer etch or PR ash.
Features
Multi-chamber system: Maximum 3 chambers
Main Chamber mode: PICP™ mode/ECCP mode
Main Substrate size:2,200mm x 2,500mm, 2,940mm x 3,370mm
Product comparison
| Gen6 | Gen8.7 | Gen10.5 | |
|---|---|---|---|
| Application | Mobile, AR/VR, Automotive LCD, OLED |
TV,Tablet,Monitor, Laptop PC LCD, OLED |
TV LCD |
| Technology | Metal Oxide, LTPS, LTPO | a-Si,Metal Oxide, LTPS, LTPO | a-Si, Metal Oxide |
| Substrate size (mm) |
1500x1850 | 2290x2620 | 2940x3370 |
| Platform | Betelex™ | Betelex™ Impressio™ |
Impressio™ |
| Chamber Mode | PICP™ | ECCP PICP™ |
ECCP
PICP™
|
| Application | Silicon layer etching, Insulating layer etching, Metal layer etching, Ashing |
Silicon layer etching, Insulating layer etching, Metal layer etching, Ashing |
Silicon layer etching, Insulating layer etching, Metal layer etching, Ashing |
Impressio,PICP and Betelex are registered trademarks or trademarks of Tokyo Electron Group in Japan and/or other countries.
