FPD Plasma Etch/Ash

Satisfying Customer’s Needs with Overwhelming Productivity

FPD Plasma Etch/Ash systems generate plasma in its vacuum chamber to etch thin-film and make electric circuits on large-area glass substrates. Our systems contribute to manufacturing liquid crystal displays (LCDs) or organic light-emitting diode displays (OLEDs) on Gen6/Gen8/Gen10.5 substrate. Since display devices get higher resolution and higher performance, FPD manufacturing increases complexity. In this background, FPD customers select TEL FPD Plasma Etch/Ash systems, which meet their requirements.

Betelex™

Today, to manufacture high-resolution and high-performance displays, the TFT process must become more complex, and higher productivity is required for plasma etch systems.
Betelex™ supports up to 5 process chambers and realize significantly higher productivity with smaller footprint and facility cost.
Betelex™ can also combine multi-process steps in separated chambers and contribute a sophisticated, up-to-date manufacturing process.
Betelex™1800 PICP™ can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.

Features
Multi-chamber system: Maximum 5 chambers
Chamber mode: PICP™ mode
Substrate size:<Standard>
1,500mm x 1,850mm

Impressio™

Impressio™ is a multi-chamber Plasma Etch/Ash system supporting Gen 6 - 10.5 substrates for various applications, small/medium displays for smartphones, and large displays for TVs.
Impressio™ series can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) devices, oxide semiconductor devices, and amorphous silicon devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, silicon layer etch or PR ash.

Features
Multi-chamber system: Maximum 3 chambers
Chamber mode: PICP™ mode/ECCP mode
Substrate size:<Standard>
1,500mm x 1,850mm (PICP™)
2,200mm x 2,500mm (PICP™)
2,940mm x 3,370mm (ECCP、PICP™)

PICP™

As flat panel displays for smartphones and other devices require higher resolutions, ultra-low power consumption, various innovative interfaces, or other new technologies, manufacturing FPD requires a more refined process, higher productivity, and better yield for Plasma Etch/Ash system. Responding to these needs, TEL developed PICP™, which is the plasma source with Innovative Technology and Concept for large FPD Plasma Etch/Ash system. PICP™ can produce extremely uniform high-density plasma on the substrate and significantly improves process uniformity. At the same time, it lowers power consumption by up to 20% or more (compared with previous TEL models), reducing the risk of electrostatic damage to devices and preventing process excursions in mass production.

PICP™ can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) devices and metal-oxide devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.

HT-910

HT-910 is a Plasma Etch/Ash system that supports the Gen 4.5 substrates. It can be equipped with up to four process chambers. It has the highest share of the Gen 4.5 market and is a standard system for amorphous silicon and LTPS processes.

HT-910 can be applied to various etch processes; metal layer (Al, Mo) etch, insulator layer (SiOx, SiNx) etch, silicon layer etch or PR ash.

Features
Multi-chamber system: Maximum 4 chambers
Chamber mode: ICP-duo mode/ECCP mode
Substrate size:<Standard>
730mm x 920mm

Product comparison

Gen10.5Gen8.5Gen6Gen4.5
MarketTVTV, Tablet, MonitorMobile, AR/VR, AutomotiveMobile, AR/VR, Automotive
Technology

LCD, OLED, a-Si,

Metal Oxide

LCD, OLED, a-Si,

Metal Oxide

LCD, Flexible OLED, LTPS, Metal Oxide

LCD, OLED, LTPS,

Metal Oxide

Substrate size(mm)2940x33702200x25001500x1850730x920
PlatformImpressio™Impressio™Betelex™
Impressio™
HT
Chamber ModeECCPPICP™PICP™ICP duo, ECCP
ApplicationSilicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing
Silicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing
Silicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing
Silicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing