FPD Plasma Etch/Ash

Satisfying customer’s needs with overwhelming productivity

A Plasma Etch/Ash system generates plasma gas within its chamber to etch thin-film patterns and make electric circuits. Our systems are optimized for manufacturing liquid crystal displays (LCDs) or organic light emitting diode displays (OLEDs). It contributes to high resolution panel manufacturing on Gen6 substrate or large size panel on Gen8/Gen10.5 substrate. Since display devices get higher resolution and higher performance, FPD manufacturing step increases complexity. In this background, FPD customers select TEL FPD Plasma Etch/Ash systems, which meet their requirement.

Betelex™

To manufacture high-resolution and high-performance displays, the process required must become more complex, and higher productivity is required from plasma etch systems. Plasma Etch/Ash system, Betelex™ supports up to 5 process chambers and enables significantly high productivity. Especially it is suitable for latest multi-step process in mobile OLED manufacturing scene. Compared with 3 P/C system, same production volume can be maintained by fewer mainframe. This reduces the system footprint and saves customer’s facility cost.
Betelex™1800 PICP™ can be applied to etch processes on LTPS (Low Temperature Poly-Silicon) devices; metal layer (Al, Mo) etch, insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.


Features
Multi-chamber system: Maximum 5 chambers
Chamber mode: PICP™ mode
Substrate size:<Standard>
1,500mm x 1,850mm

Impressio™

The Impressio™ is a multi-chamber Plasma Etch/Ash system supporting Gen 6 - 10.5 substrates. It supports various applications, from small/medium displays for smart phones and large displays for TVs.
The Impressio™ series can be applied to etch processes on LTPS (Low Temperature Poly-Silicon) devices, oxide semiconductor devices or amorphous silicon devices; metal layer (Al, Mo) etch, insulator layer (SiOx, SiNx) etch, silicon layer etch or PR ash.

Features
Multi-chamber system: Maximum 3 chambers
Chamber mode: PICP™ mode/ECCP mode
Substrate size:<Standard>
1,500mm x 1,850mm (PICP™)
2,200mm x 2,500mm (PICP™)
2,940mm x 3,370mm (ECCP、PICP™)

PICP™

As flat panel displays for smartphones and other devices require higher resolutions and new technology which realizes exceptional performance like low power consumption, various innovative display interfaces or others, manufacturing FPD requires more refined process, higher productivity, and better yield for Plasma Etch/Ash system. Responding to these technology needs, TEL developed PICP™ which is the plasma source with Innovative Technology and Concept for large FPD Plasma Etch/Ash system. PICP™ can produce extremely uniform high density plasma on the substrate and significantly improves process uniformity. At the same time, it lowers power consumption by up to 20% or more (compared with previous TEL models), reducing the risk of electrostatic damage to devices and preventing process excursions in volume production.

PICP™ can be applied to etch processes on LTPS (Low Temperature Poly-Silicon) devices and metal-oxide devices; metal layer (Al, Mo) etch, insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.

HT-910

HT-910 is a Plasma Etch/Ash system that supports the Gen 4.5 substrates. It can be equipped with up to four process chambers. It has the highest share of the Gen 4.5 market and is a standard system for amorphous silicon and LTPS processes.

HT-910 can be applied to various etch processes; metal layer (Al, Mo) etch, insulator layer (SiOx, SiNx) etch, silicon layer etch or PR ash.

Features
Multi-chamber system: Maximum 4 chambers
Chamber mode: ICP-duo mode/ECCP mode
Substrate size:<Standard>
730mm x 920mm

Product comparison

Gen10.5Gen8.5Gen6Gen4.5
MarketTVTV, Tablet, MonitorMobile, AR/VR, AutomotiveMobile, AR/VR, Automotive
Technology

LCD, OLED, a-Si,

Metal Oxide

LCD, OLED, a-Si,

Metal Oxide

LCD, Flexible OLED, LTPS, Metal Oxide

LCD, OLED, LTPS,

Metal Oxide

Substrate size(mm)2940x33702200x25001500x1850730x920
PlatformImpressio™Impressio™Betelex™
Impressio™
HT
Chamber ModeECCPPICP™PICP™ICP duo, ECCP
ApplicationSilicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing
Silicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing
Silicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing
Silicon layer etching,
Insulating layer etching,
Metal layer etching,
Ashing