The Ulucus™ series of semiconductor production equipment integrates TEL’s market-leading and production-proven Coater/Developer platform technology with several advanced technologies including wafer cleaning. As further semiconductor scaling and performance enhancements are crucial to such devices as CMOS image sensors, next-generation memories, and advanced logic chips, chip manufacturers are increasingly adopting 3D high-density packaging technologies using permanent wafer bonding methods. TEL anticipates a significant growth in permanent wafer bonding processes, and has introduced high-volume processing systems equipped with innovative technologies to address the customers’ production needs.
