Tokyo Electron Releases Prexa™ SDP, a New Device Prober

Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today announced the launch of Prexa™ SDP,^*1 a device prober that meets the need for testing singulated devices.

As the demand for computing capability surges, advanced semiconductors used in high-performance computing (HPC)^*2 and AI applications increasingly require the latest 2.5D/3D packaging technology, which integrates multiple devices into a single chip. Improving the final yield of these products requires selecting Known Good Device (KGD)^*3 from a pool of singulated, unpackaged devices. Challenges in the advanced KGD screening test include effectively absorbing heat and precisely controlling the temperature during testing. In addition to existing tests on entire wafers, high-precision testing of singulated devices will be essential.

The Prexa™ SDP builds on the diverse applications and reliable platform proven on TEL's Prexa™ and other existing wafer probers. It features original temperature control technology for high-heat-generating devices and can be used to test singulated devices.
In addition to a GUI and well-established wafer prober technologies, such as high-precision contacts, wafer handling, and probe mark inspection, the new system features superior heat absorption capabilities for handling high-heat-generating devices, and a thermal head capable of high-precision active thermal control. These features ensure reliable transportation of devices and accurate KGD selection.

"The testing process is more important than ever for improving the final yield of semiconductor products with advanced packaging technology," said Yohei Sato, General Manager of ATS BU at TEL. "The newly developed Prexa™ SDP device prober combines TEL's well-established wafer prober technology with its proprietary thermal control technology. The testing solution provides the superior testing quality and system reliability necessary for advanced packaging operations. We will continue to develop innovative technologies and products to meet our customers' needs."

TEL advocates for the development of production and testing technologies for advanced packaging of HPC/AI semiconductors, with the goal of improving yield and product quality.

SDP: Singulated Device Prober. It is a probing system that transports and selects singulated, unpackaged KGDs.

HPC: High-Performance Computing. A technology solution that processes and calculates data much faster than ordinary computers.

KGD: Known Good Device. The term refers to unpackaged devices that have been tested and proven defect-free.

Prexa is a registered trademark or trademark of Tokyo Electron Group in Japan and/or other countries.