Tokyo Electron Launches Single Wafer Deposition Systems Episode™ 1 and Episode™ 2 DMR, Announces Planned Release of Episode™ 2 QMR

Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today launched single wafer deposition systems EpisodeTM 1 and EpisodeTM 2 DMR, and announced the planned release of EpisodeTM 2 QMR.

In response to customers’ needs to advance device scaling and 3D stacking while using a greater variety of deposition materials, TEL is significantly expanding the lineup of its single wafer deposition systems.

The Episode 1 platform integrates up to eight process modules and supports continuous execution of multiple processes, offering customers the ability to handle increasingly complex processes as device features continue to shrink. The platform can be configured with the OPTCURETM module that removes the native oxide layer from silicon wafers and the ORTASTM module for depositing titanium, both of which help reduce the contact resistance of metal interconnects in advanced logic devices. Aiming to reduce contact resistance even further, TEL is focusing on new materials and accelerating the development of suitable deposition processes.
Episode 2 is a platform capable of simultaneously transferring two wafers. Combining high productivity and a reduced footprint, the system can significantly improve customers’ fab efficiency. Two types of process modules designed with different concepts will become available for this platform.
The DMR (Duo matched reactor) module can simultaneously perform deposition on two wafers. Succeeding the Triase+ TM EX-IITM series of products that have been widely adopted by memory device manufacturers, DMR also offers various new features for dealing with continued 3D device stacking and higher aspect ratios.*
The QMR (Quad matched reactor) module is capable of simultaneous deposition on four wafers. The module uses an innovative plasma source, supporting the plasma deposition process that has significant market growth potential.

Episode 2 QMR is scheduled to be released for production use in 2026.

Unlike their predecessors, the Episode series of products come with enhanced equipment data collection and edge data processing systems. Combined with other features including an analytics application, Episode can improve equipment availability and engineer efficiency. The data on equipment availability and energy use are integrated in a database, which can be used to help reduce the burden on the environment.

“The Episode series has evolved from the Triase+ TM series that has been favored by our customers for many years,” says Shigeki Nakatani, Vice President & General Manager, TFF BU. “The Episode series of single wafer deposition systems can handle even more complex processes while offering high levels of productivity and environmental performance. We will continue to satisfy our customers’ needs through persistent technology development and process module enhancements.”

* Aspect ratio: The depth and width ratio of a patterned trench etched on a wafer

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Episode 1

Episode™ 1

Episode 2 DMR

Episode™ 2 DMR

Episode 2 QMR

Episode™ 2 QMR

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Corporate Communication Dept., Tokyo Electron