IITC2024

Tokyo Electron (TEL) is proud to be a sponsor of the 2024 IEEE International Interconnect Technology Conference (IITC), which will be held June 3-6 in San Jose, California. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability, as well as how it applies to 2.5D/3D and heterogenous integration. TEL will give four presentations. Please join us!


Tuesday, June 4, 2024
Session 2: Advanced Interconnects I
Process Control for the Modification of Ruthenium Resistivity in Scaled Subtractive Interconnects
Jack Rogers, Hirokazu Aizawa, Nicholas Joy, Rinus Lee, Kenichi Imakita, Hojin Kim, Toru Hisamatsu
TEL Technology Center, America, LLC

Wednesday, June 5, 2024
Poster Session
Patterning process and electrical yield optimization at the limits of single exposure EUV 0.33 NA: a pitch 26nm damascene process
Victor M. Blanco Carballo, Kevin Vandersmissen, Bart de Wachter, Kathleen Nafus, Yannick Feurprier, Thiam arame, Alex Hsu, Cyrus Tabery, Jan Doise, Peter De Schepper
IMEC, TEL, ASML, Inpria

Thursday, June 6, 2024
Session 12: Materials & Unit Process III
Selective CVD Ru on W by sequential small molecule inhibitor treatments
Kai-Hung Yu, Ryota Yonezawa, Hirokazu Aizawa, Wajda Cory, Kawasaki Hiroaki, Mayersky Joshua, Suzuki Hidenao
TEL Technology Center, America, LLC

Session 13: DTCO & Advanced Interconnects IV
Towards a comprehensive solution for future interconnects
Gert Leusiak
TEL Technology Center, America, LLC