SPIE Advanced Lithography / 2021 Digital Forum
Event Summary
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Date
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2021.02.22 - 2021.02.26
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Location
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virtual conference
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Target
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Process Engineer
The SPIE Advanced Lithography will be held online in February 22-26, 2021. This event will focus on patterning technologies such as EUV lithography, metrology, and process integration, which are necessary for scaling. Tokyo Electron (TEL) is working on scaling by utilizing advantage of its wide lineup of semiconductor production equipment such as coater/developer and etch. In this event we and our collaborators will make 13 presentations on these latest research, including 4 invited talks. Join and inspired at the online conference as watching a great presentation from TEL!
Invited
1. DSA process optimization for high volume manufacturing
2. Atomic Level Control of Pattern Fidelity During SAC Etch
3. Key Challenges and Solutions in Forthcoming Device Scaling
Oral presentation
1. Exploring nano-scale effects of selective spin-on polymer deposition
2. Self-aligned double pattern process using DSA pattern
3. Fundamental study of polymer dynamic behavior in resist processing
4. Novel Bottom-Up Organic Mandrel Growth to Enable Organic Mandrel EUV SADP for sub-5nm Node Technologies
5. LER Reduction Strategies for 20nm Pitch EUV Self-Aligned Double Patterning (SADP) with Self-Aligned Block (SAB) Formation
6. Advanced multiple patterning technologies for high density hexagonal hole arrays
