PRiME 2020
Event Summary
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Date
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2020.10.04 - 2020.10.09
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Location
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virtual conference
The PRiME 2020 will be held as an online virtual conference, on October 4-9. The conference will focus on the electrochemistry and solid state science and technology. Tokyo Electron (TEL) and collaborators will have the honor of participating in three research results including an invited talk, titled “Spatial ALD Challenges and Opportunities in Advanced Integrated Circuit Manufacturing”. All PRiME abstracts will be published as planned in the ECS Digital Library.
For the first time in the history of PRiME, you can access to all of the program’s technical presentations will be freely available to the entire global community. All are welcome to attend!
Invited talkSpatial ALD Challenges and Opportunities in Advanced Integrated Circuit Manufacturing
D. O'Meara*1, A. Dip*1, M. Igeta*2, R. D. Clark*3, H. Higuchi*3, E. Liu*3, A. Raley*3, J. Smith*3, K. Tapily*3, D. Triyoso*3, and G. J. Leusink*3
*1 Tokyo Electron America, Inc.
*2 Tokyo Electron Limited
*3 TEL Technology Center, America, LLC
Investigation of Post - Bond Distortion in Direct Wafer Bonding
N. Ip*1, A. Nagata*1, N. Kohama*2, N. Wada*2, and K. Motoda*2
*1 Tokyo Electron America, Inc.
*2 Tokyo Electron Kyushu Limited
Evaluation of Silicon Nitride Film Formed By Atomic Layer Deposition on the Silicon Substrate with Trench Structure Using Angle-Resolved Hard X-Ray Photoelectron Spectroscopy
T. Nishihara*1, R. Yokogawa*1,2, Y. Otsuki*3, M. Kagaya*3, and A. Ogura*1,2
*1 School of Science and Technology, Meiji University
*2 Meiji Renewable Energy Laboratory
*3 Tokyo Electron Technology Solutions Limited
