AVS 66th International Symposium & Exhibition
Event Summary
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Date
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2019.10.20 - 2019.10.25
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Location
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United States（Columbus）
AVS 66th International Symposium & Exhibition will be held at Columbus, USA, from October 20–25, 2019.
Technical sessions cover the latest researches on vacuum and equipment technology; materials and interface characterization; and materials processing.
Tokyo Electron(TEL) will make 11 oral presentations including three invited talks.
Invited Talks
1. BEOL Etch Challenges and Solutions for Advanced Process Nodes
2. Innovative Future Etch Technology by Atomic-order Control
3. Atomic Layer Etch: Real World Utilization of an Idealized Solution
1. Angélique Raley*1‚ Katie Lutker-Lee*1‚ Xinghua Sun*1‚ Yen-Tien Lu*1‚ Qiaowei Lou*1‚ Nicholas Joy*1‚ Michael Edley*1<>4; Kensuke Taniguchi*2‚ Manasobu Honda*2, Peter Biolsi*1
*1 TEL Technology Center‚ America‚ LLC
*2 Tokyo Electron Miyagi Ltd.
2. Yoshihide Kihara‚ Takayuki Katsunuma‚ Sho Kumakura‚ Toru Hisamatsu‚ Masanobu Honda (Tokyo Electron Miyagi Ltd.)
3. Peter Biolsi (TEL Technology Center‚ America‚ LLC)
Oral Presentations
1. Process Development and Mechanism Analysis of Low Temperature ALD TiN with TiCl4/Monomethylhydrazine
2. Non-selective Silicon Oxide and Nitride Etch in Oxygen/Nitrogen-containing Fluorocarbon Plasmas
3. Impact of Plasma Process on Source/Drain Epitaxy Film
4. Advanced Selective Chemical Dry Etch for Oxide and Si-based Material
5. Effect of Polymerization on Ar+ Bombardment Modification of SiO2 and Si3N4 Substrates: Molecular Dynamics Simulation Study
6. Review and Demonstration of Feature Scale Simulations
1. Taiki Kato‚ et al.
2. Yu-Hao Tsai, et al.
3. Yun Han, et al.
4. Li-Hung Chen, et al.
5. Hojin Kim, et al.
6. Paul Moroz
