TOKYO ELECTRON LIMITED

SEMICON / FPD China 2026

Event Summary

Date

2026.03.25 - 2026.03.27

Location

Shanghai New International Expo Centre, China

Target

Device Engineer Process Engineer Mechanical Engineer AI Engineer Software Engineer Data Scientist / Analyst

SEMICON/FPD China 2026 will take place at the Shanghai New International Expo Center starting March 25, following the conference commencing on March 22. As one of the world’s largest platforms, this premier event comprehensively covers the latest technological trends across the semiconductor industry. It encompasses the entire value chain—from chip design, manufacturing, packaging, and testing to equipment, materials, photovoltaics, and display technologies.

This year, over 20 technical forums will be held, focusing on key market topics such as SIIP China, compound semiconductors, AI smart applications and automotive chips, smart manufacturing, advanced materials, and heterogeneous integration (advanced packaging). Additionally, the concurrently held China Semiconductor Technology International Conference (CSTIC) is highly regarded as an international forum fostering industry-academia-research collaboration in microelectronics technology within China.

Tokyo Electron is scheduled to deliver presentations on cutting-edge technologies at multiple forums during SEMICON China. Together with industry stakeholders, we are committed to driving the sustainable growth of the semiconductor industry by accelerating the integration of next-generation technologies characterized by high speed, large capacity, high reliability, and low power consumption.

TEL Booth: N1,1401

Keynote speech

Forum:Heterogeneous Integration (Advanced Packaging) International Conference
Date:Tuesday, March 24, 2026
Time:16:20-16:40
Venue: Pudong Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
Title:Technology & Fusion, enabling AI innovation
Speaker:Norito Matsumura, Senior Director of Global Sales Division, Tokyo Electron

Forum:IC manufacturing Supply Chain International Conference - Wafer Process and Equipment
Date: Thursday, March 26, 2026
Time: 10:30-10:50
Venue: Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai
Title:DX concept enabling smart manufacturing with AI and Robotics
Speaker:Masaki Shinoda, VP of Product & Service DX solution Department, Tokyo Electron

Forum:SCC Sustainability and ESG Summit Forum
Date: Friday, March 27, 2026
Time: 09:25-09:50
Venue: Pudong Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
Title:Keynote Speech
Speaker:Supika Mashiro,Advisor of Technology Vision & Environment Strategy Department,Tokyo Electron

Forum Conference:CSTIC Symposium III: Dry & Wet Etch and Cleaning
Date:Monday, March 23, 2026
Time:14:30-14:55
Venue: Pudong Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
Title:RF Pulsing Technology for BEOL Etch Process
Speaker:Bo Wang,Manager of Etch Department,Tokyo Electron Shanghai