Must see for Device and Process Engineers! IITC2023

Concept: Interconnect technologies such as advanced metallization and 3D Integration technologies, Air Gap

Tokyo Electron (TEL) is proud of to be a sponsor of the 2023 IEEE International Interconnect Technology Conference (IITC) will be held May 22-25 in Dresden, Germany. The conference will focus on the interconnect technologies such as advanced metallization and 3D integration technologies for ULSI IC applications. TEL will give two presentations. Please join us!

TEL will continue to contribute to the technological innovation of semiconductors by always pursuing the Best Products and Best Technical Service. As we celebrate our 60th anniversary this year, we will position this milestone as a "new point of change" and continue to take on further challenges and evolve, contributing to the development of a dream-inspiring society!

TEL will continue to pursue the Best Products and Best Technical Service while contributes to technological innovation in semiconductors. As this year marks the 60th anniversary of our founding— which we consider to be a new transformative point for us — we will take on new challenges and continue to evolve, contributing to the development of a dream-inspiring society!

Tuesday, May 23, 2023
Session 3: Advanced Interconnects I
14:10 – 14:30
A Study of Resistivity Control for Subtractive Interconnects Using Ruthenium
J. Rogers
TEL Technology Center, America, LLC

Thursday, May 25, 2023
Session 12: Advanced Interconnect II
14:40 – 15:00
12.2 Pre-treatment study for barrier-less Ruthenium filling into single damascene via of sub 20nm hole size
R. Yonezawa,
TEL Technology Center, America, LLC