SEMICON SEA 2022

Tokyo Electron (TEL) is proud of to be a sponsor of SEMICON SEA 2022 held on June 21-23 in Penang, Malaysia. This is the largest microelectronics exhibition and conference in South East Asia, bringing together industry experts and leaders from the semiconductor ecosystem and academia. We are hopeful that vibrant and constructive discussions supporting the rapidly growing semiconductor industry in South East Asia, especially Advanced Packaging/BEOL technology, takes place during the SEMICON SEA 2022.
Advanced Packaging platforms [Cu bump, fan-in wafer-level packaging (FIWLP), fan-out wafer-level packaging (FOWLP), 2.5D interposers and 3D stacking using hybrid bonding] will continue to garner more interest from the industry over the traditional wire bonding technologies as technology nodes continue to shrink and migrate towards more cost-effective solutions.
We look forward towards working closely with our customers to understand the integration challenges with bumps, pillars and RDLs, through silicon vias, interposers for IOT, as well as AI and 5G applications.
The Advanced Packaging technologies for integrating multiple heterogeneous devices are advancing along with the continued physical scaling in semiconductor manufacturing. This means that the importance of the wafer testing process to reliably determine KGD (Known Good Die) is becoming greater than ever before as more and more advanced performance features are incorporated into the devices.
At SEMICON SEA 2022, we are looking forward to a robust line-up of activities, and discussions with experts and thought leaders from semiconductor companies around the world.