TOKYO ELECTRON LIMITED

3D IC Challenges with Advanced Metrology Technologies
Dr. April Shuyan Zhang, Tokyo Electron America

People

Tokyo Electron (TEL) believes that “people drive a company’s growth, and employees are the source of value creation.” Based on this philosophy, diverse talent across the global TEL Group is thriving as the company strives to realize its vision of being “a vibrant and innovative company that contributes to semiconductor technological advancement.”

In this article, we interviewed April Shuyan Zhang, who develops measurement technologies to support future semiconductor scaling, about the importance of collaboration in innovation. Since joining TEL in 2023, she has been responsible for developing advanced imaging and sensing systems at Tokyo Electron America (TEL America). She currently serves as a Principal Systems Design Engineer.

Profile

  • Dr. April Shuyan Zhang

    She received her Ph.D. in Applied Physics from Harvard University in 2018, where she researched the design and fabrication of meta lens optical devices. She joined Tokyo Electron America in 2023 as a Principal Systems Design Engineer and is currently engaged in developing integrated metrology systems for TEL etchers and bonders.
    She has published over 30 academic papers and received numerous awards. Within TEL, she was honored with the Best Paper Award and the Collaboration Award at internal technical forum in the U.S. in 2024 and 2025, respectively, and the Best Paper Award at an internal technical forum globally in 2024. Since 2022, she has been a Senior Member of IEEE*. She also serves as a committee member of the IEEE Electronics Packaging Society Silicon Valley Chapter.
    *IEEE: Institute of Electrical and Electronics Engineers, one of the world’s largest professional engineering organizations.

What is the mission of measurement technologies for future semiconductor scaling?

“With the advancement of AI, demand for high-density interconnects is increasing, and parts of the semiconductor market are expanding rapidly. Requirements associated with advanced packaging are accelerating the growth of 3D stacking technologies.

In future CMOS designs*, logic and memory will increasingly be stacked in three dimensions, making bonding technologies for connecting chips essential. As a result, inspection and metrology tools with higher precision than ever before are required. X-ray imaging, which enables non-destructive inspection of internal structures, is expected to be one of the most effective solutions to address these challenges.
In response to these accelerating trends, we will design metrology solutions that meet evolving needs and expand the company business in advanced packaging and 3D integrated circuit (3DIC) fields.”

*CMOS: Complementary MOSFET, a circuit technology widely used in digital LSIs such as CPUs and memory due to its low power consumption in standby mode.

What aspects of your work do you find rewarding?

“My work is very enjoyable for several reasons. First, the imaging projects I’m currently working on align perfectly with my background in optics and microscope system design. I’m glad that I can leverage my expertise to develop advanced systems at TEL. Second, I truly enjoy working collaboratively with my colleagues.”

What kind of members are in your research team?

“Our team is a fusion of diverse expertise. For example, the teams in the U.S. contribute expertise in X-ray and optical technologies, and the teams in Japan provide valuable customer insights and process knowledge.

By working together, we deliver solutions that are both technically robust and aligned with customer needs. This synergy is essential for TEL to establish a unique position as a leader in addressing metrology challenges in semiconductor processes.”

How do research teams in the U.S. and Japan collaborate?

“As teams grow and become geographically distributed, coordination becomes more complex. Maintaining alignment between R&D activities in the U.S., and the teams in Japan is an ongoing challenge.

Despite the distance, we have established strong communication through biweekly meetings with the U.S. team and quarterly reviews with stakeholders in Japan. Regular knowledge-sharing and problem-solving sessions help align the team’s direction and sustain project momentum. I believe our research team is an excellent example of effective cross-regional teamwork.

It is a great experience to work with colleagues across Japan and the U.S. Interacting with colleagues from different backgrounds allows me to gain valuable feedback and perspectives, learn a great deal, and expand my abilities and knowledge. I am truly grateful to be part of such an outstanding team.”

What is important for enabling smooth collaboration?

“Successful collaboration depends on leveraging each member’s unique expertise and ensuring transparent communication. It is essential to clearly share activities between teams in the U.S. and Japan and align both technical and business goals.
Strong collaboration requires trust, regular communication, and a shared commitment to effectively meet customer needs. Clear role definitions and open communication are key.”

What is the significance of sharing goals as a team?

“Currently, the biggest challenge our team faces is optimizing experimental conditions to achieve the highest image quality. This experience reinforces that breakthrough innovation rarely happens in isolation. It also allows me to deepen my understanding of TEL’s culture and its unique solutions and strategies. We are working together toward the success of this project.
I believe TEL has limitless growth potential in the industry. We must remain open-minded, maintain a strong willingness to learn, and continue to grow alongside the company.”

At White Mountain in the U.S.

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