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How Semiconductor is made

14
Interconnect Formation

Patterning

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The patterning process is implemented on a dielectric film to make contact holes.

Semiconductor equipment

Photoresist Coater/Developer, Plasma Etch System, Exposure System (Scanner), Resist Stripping System
15
Interconnect Formation

Contact Formation

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The voids are filled with metal using the CVD process. Excess metal film is polished off.

Semiconductor equipment

Metallization System (CVD, PVD), CMP System
16
Interconnect Formation

Patterning

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An intermetal dielectric film (such as low-k film) is deposited on the surface. The patterning process is then implemented to cut trenches where wires are to be laid.

Semiconductor equipment

Photoresist Coater/Developer, Plasma Etch System, Exposure System (Scanner), Resist Stripping System
17
Interconnect Formation

Interconnect Formation

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The trenches are filled with a metal layer, and the surplus metal is polished off. The cycle of intermetal layer deposition, trench filling with metal, and planarization is repeated until the necessary numbers of wiring layers are formed.

Semiconductor equipment

Metallization System (CVD, PVD, Plating System), CMP System
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