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How Semiconductor is made

19
Assembly

Dicing

RESTART

The wafer is cut into IC chips using diamond blades.

Semiconductor equipment

Dicing Saw
20
Assembly

Die Bonding

RESTART

The separated die is attached to the package substrate using an adhesive such as silver paste.

Semiconductor equipment

Die Bonder
21
Assembly

Wire Bonding

RESTART

The separated die is connected to the inner leads of the semiconductor package using gold bonding wire.

Semiconductor equipment

Wire Bonder
22
Assembly

Molding

RESTART

The die is sealed in an epoxy resin envelope.

Semiconductor equipment

Molding System
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