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How Semiconductor is made

03
Pattern Formation

Photoresist Coating

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The coater spins a wafer at high speed and uniformly applies a UV-sensitive photoresist on its surface.

Semiconductor equipment

Photoresist Coater/Developer
04
Pattern Formation

Exposure

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The stepper aligns the circuit pattern drawn on a glass mask over a wafer coated with photoresist, and then irradiates ultraviolet (UV) light to transfer the pattern onto the photoresist.

05
Pattern Formation

Development

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The developer applies a liquid developing agent uniformly over the wafer to fix the transferred image. Exposed area becomes soluble in developer in the case of positive-type photoresist, and unexposed area becomes soluble in the case of negative-type photoresist. That is how etch mask pattern is generated in photolithography.

Semiconductor equipment

Photoresist Coater/Developer
06
Pattern Formation

Etching

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Plasma etchers etches films of unmasked area by photoresist.

Semiconductor equipment

Plasma Etch System
07
Pattern Formation

Ashing / Cleaning

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After etching, photoresist is removed by ashing.
Wet cleaning frequently follows ashing in order to remove residues.

Semiconductor equipment

Resist Stripping System
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