Hundreds to thousands of integrated circuits (ICs) are constructed on a wafer through various processes during the manufacturing of semiconductors. A test system examines whether the IC formed on a wafer functions properly as a product. TEL's main test system product, the wafer prober, enables electrical testing by connecting it to a tester and contacting the probe needles to IC electrodes on the wafer. In order to enable measurement at the IC chip's guaranteed product temperature, it is equipped with advanced functions to fulfill various requirements such as accurate control of the ambient temperature (chuck temperature) from high temperatures (300, 150℃) through to low temperatures (-55℃).
Wafer/Dicing Frame Prober
Multi-Cell Test System
High-speed Probe Mark Automatic Inspection System
Data Management System for Wafer Prober
Operation Support System for Wafer Prober