Coater/Developer ACT™ Series

Established position as an industry standard system

The CLEAN TRACK™ ACT™ Series was developed as coater/developer to support 300/200mm wafer processes, based on the technology from the CLEAN TRACK™ Mark Series. The key concepts are high throughput, footprint reduction, and up time improvement. Additionally, these technologies are also applicable to mask process and low-k dielectrics, besides photolithography. Thanks to its high reliability as an industry standard system, the ACT™ Series continues to contribute to the customers’ productions.

CLEAN TRACK™ ACT™12/ACT™ 8

The CLEAN TRACK™ ACT™ 12 and ACT™ 8 are 300/200mm coater/developer which enable stable, high-quality processing and smooth transition from R&D to volume production. The in-line model with exposure tool achieved almost the same footprint and moreover provides higher throughput by high-speed transfer system compared to the previous track series. Uptime has been improved by increasing the reliability of each component and simplifying maintenance. In addition, the platform supports DUV processing through the use of a ULPA chemical filter and a high precision oven.

CLEAN TRACK™ ACT™12 SOD/ACT™ 8 SOD

The CLEAN TRACK™ ACT™ 12 SOD/8 SOD are spin-on dielectric systems designed to coat, bake, and cure of low-k dielectric materials. Its innovative process modules provides optimally process for organic, inorganic, hybrid, and porous materials. In addition, CLEAN TRACK™ ACT™ 12 SOD/8 SOD equipped in-line curing, which had been traditionally performed in a furnace, by incorporation of high temperature hotplate processing in a low-oxygen environment.

CLEAN TRACK™ ACT™ M

The CLEAN TRACK™ ACT™ M incorporates three separate high-performance application modules: photomask developer, resist coater, and PEB (Post-Exposure Bake) oven. The system provides sophisticated process control and techniques in the photomask manufacturing process to meet the advanced requirements from industry for OPC(Optical Proximity Correction), phase shifting, and the use of chemical amplification resists. The system extends TEL's long-standing semiconductor and FPD coating and developing technology, and achieves high reliability by adopting CLEAN TRACK™ ACT™ technology.

Product comparison

ACT™ 12
ACT™ 12 SOD
ACT™ 8
ACT™ 8 SOD
ACT™ M
Wafer size (mm)200,300100,150,200150 (6 inch MASK)
AvailabilityNew, Certified usedNew
Throughput (wph)Inline: 120Inline: 120S/A: 3
Processi-line, KrF, ArF, SOD/SOG, PlEB
SubstratesSi, GlassSi, GaAs, GaN, GaP,
SiC, Glass, Sapphire,
AlTiC, LT, Thin
6025 MASK
Additional featuresEnclosed system, Precision hotplatesEnclosed system