Etch system UNITY™ Series
The long-selling etch system has been receiving a lot of attention from the SiC market
The UNITY™ Me achieves excellent cost performance for plasma etch process within 200mm wafer, which provides exceptional reliability and productivity. Recent years, the system has a great deal and favorable approval through demonstration of high performance Si/SiC trench etch process for leading-edge power devices manufacturing.
UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools.
UNITY and SCCM are is registered trademarks or trademarks of Tokyo Electron Limited in Japan and/or other countries.