Deposition TELINDY™ Series

State of the art 300mm batch furnace with over 4600 systems shipped

TELINDY PLUS™ is the industry’s premier iso-thermal large batch platform for oxidation, anneal and LPCVD deposition which are at the core of semiconductor manufacturing. TELINDY PLUS™ incorporates the pinnacle of hot wall reactor technology and enables superb film quality while maintaining the ultimate in process control and run to run stability. Additionally, TELINDY PLUS™ is designed with all of the essential architectural design features which maximizes wafer throughput per square foot. Since its introduction, TELINDY PLUS™ has continued to evolve in capability featuring increased wafer batch sizes and expanded process applications for low temperature ALD (Atomic Layer Deposition) and plasma assisted deposition (TELINDY PLUS™ IRad™) required by ever shrinking device structures, thus supporting the leading edge in device manufacturing.

TELINDY PLUS™

TELINDY PLUS™ represents the convergence of demonstrated experience and leading edge thermal processing technology. TELINDY PLUS™ incorporates specialized features originally developed for short TAT (Turn Around Time) on the TELFORMULA™ minibatch system as well as field proven, high productivity design elements from the previous generation TELINDY™ platform. Process performance and productivity have continued to improve and further expanded to ALD applications. New enhancements include improved maintenance access through architectural optimization to further reduce maintenance down time. Dry gas chamber cleaning and low O2 environment loading area control have realized tangible gains in small particle management contributing to yield increases. The highest levels of productivity have been achieved by combining 125 wafer load size with TEL’s FTPS™ responsive heater capable of rapid heating and cooling coupled with a dual boat system option. TELINDY PLUS™ applications range from traditional silicon treatments such as diffused oxides and anneals to LPCVD Si (Poly Si, a-Si), SiO2, Si3N4 to leading edge ALD SiO2, Si3N4 and high-k dielectrics as well as radical (non-plasma) oxidation.

  • CVD Si surface morpgology

TELINDY PLUS™ IRad™

TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.

TELFORMULA™

TELFORMULA™ is the semiconductor industry’s most advanced iso-thermal minibatch platform. TELFORMULA™ incorporates a number of innovative technologies specifically developed to address the industry’s need for a 300mm high speed batch platform capable of delivering short TAT (Turn Around Time) both suitable for product development and simultaneously capable of meeting demanding, high-volume production requirements. The short TAT is achieved by the convergence of multiple new core technologies, such as a metal-free fast ramping heater, low thermal mass chamber, rapid gas volume purge/displacement and a high speed wafer handling unit. The all quartz reactor concept provides the ideal processing environment for attaining the ultimate level of cleanness which is maintained by in-situ chamber dry gas cleaning reducing maintenance downtime and related costs. TELFORMULA™ is the ideal platform for a wide variety of semiconductor processes including LPCVD Si (Poly, a-Si), Si3N4, SiO2, ALD High-k, ATM/LP Oxidation, Oxynitridation, etc.

TELINDY™

TELINDY™ is an innovative thermal processing system for 300mm wafer which has all the functionality of high-reliable ALPHA-303i and TELFORMURA™ that enables short TAT thermal processing. Newly designed heater and process chamber expands its performance up to 125 wafers in a batch and provides various process applications with overwhelming throughput.

ALPHA(α)-303i

ALPHA-303i is 300mm batch thermal processing system equipped functions from the high technology that is cultivated with ALPHA-8SE.

ALPHA-8SE

ALPHA-8SE is a batch thermal processing system which covers multiple applications over a wide temperature range. The ALPHA-8SE was introduced for 200mm wafer processing in the mid 1990’s. Since its introduction, the ALPHA-8SE has undergone continuous improvements to productivity, reliability and stability enabling performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low pressure radical oxidation and low temperature nitrides. The ALPHA-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including: oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD.

ALPHA-8S

ALPHA-8S is the long-seller batch thermal processing system for silicon wafers up to 200mm. Maximizing the efficiency and productivity through continuous improvement, as a result, ALPHA-8S set the standard for vertical furnace. The system provides a wide range of process applications such as Wet/Dry Oxidation, Anneal, LPCVD of Si, Si3N4 and SiO2. Various type of UGK (Up Grade Kit) are available, which include a GUI controller and other options to enhance its productivity and expand the product’s life.

Product comparison

TELINDY PLUS™TELFORMULA™TELINDY PLUS™ IRadTELINDY™ALPHA(α)-303iALPHA-8SEALPHA-8S
Wafer size (mm)300300300300300100,150,200150,200
AvailabilityNew, Certified usedCertified usedNewCertified usedCertified usedCertified usedCertified used
Production load max-125-50-125-125-100-150-150
Cassette stocker-18-10-18-16-16-21-21
Process

Thermal ALD, LPCVD,
Oxididation/Anneal

Oxide, Anneal, Nitrade,
Poly, TEOS, High-k

Plasma Assisted ALD
SiN, SiO2*
Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO, High-k

Oxide, Anneal, Nitrade,
Poly, TEOS, HTO

ReactorThermalThermalPlasmaThermal/PlasmaThermalThermalThermal
Process tempRT-1100CRT-1000CRT-800CRT-1100CRT-1200CRT-1250CRT-1250C
Additional features, Option

N2/LL
Gas cleaning

N2/LL
Gas cleaning

N2/LL
Gas cleaning
*RT SiO2
N2/LL
Gas cleaning
Advance platform

N2,/LL, Gas cleaning:
CIF3 for poly

N2,/LL, Gas cleaning:
CIF3 for poly

N2/LL, Gas cleaning:
CIF3 for poly