Thermal Processing


The TELINDY PLUS is further performance enhancement of TELINDY with increased mass productiveness in the short TAT thermal processing system field, a new segment created by TELFORMULA. Adoption of the wafer transfer mechanism and introducing a new framework, it has improved both the productivity and the air tightness of the wafer standby area.


High performance (125 wafer specification, FTPS heater, short TAT, etc.)
Thin film controllability and high quality at a low temperature (TELINDY PLUSTM, IRadTM, ALD, SiN)
Low particle performance achieved through dry gas cleaning
Improved maintenance through revision of the unit installation structure


CVD SiO2, SiN, Si (Poly Si, a-Si)
ALD High-k
Thermal oxidation, radical oxidation, annealing
TELINDY,TELINDY PLUS,TELFORMULA,IRad and FTPS are registered trademarks or trademarks of Tokyo Electron Limited in Japan and/or other countries.

Semiconductor Production Equipment : Thermal Processing


  • Semiconductor Production Equipment
    • Thermal Processing
    • Coater/Developers
    • Etch system
    • Surface Preparation system
    • Single Wafer Deposition
    • Test system
    • Wafer Bonding/Debonding
    • SiC Epitaxial CVD System
    • Gas Cluster Ion Beam System
    • Advanced Packaging
  • Flat Panel Display Equipment
    • FPD Coater/Developer
    • FPD Etch/Ash system
    • Inkjet printing system for manufacturing OLED panels
  • Field Solutions
  • Chip Making Process