Must for device and process engineers! ADMETA Plus 2023
Event Summary
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Date
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2023.10.11 - 2023.10.13
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Location
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Hybrid (online and on-site)
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Target
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Device Engineer Process Engineer
The Advanced Metallization Conference 2023, one of the most advanced conferences dealing with all aspects of advanced interconnect technology, will be held as a hybrid event from October 11 to 13!
Interconnect technology is becoming more and more important to realize low resistance, high integration, high functionality, low cost, and high reliability in a wide variety of device fields. To meet these requirements, comprehensive discussions will be held by researchers and engineers from industry, academia, and government, focusing on interconnect-related materials, processes, design, packaging, equipment, cost, and analysis technologies, from basic to applied development to discuss solutions to various issues. Tokyo Electron (TEL) will give three presentations including an invited talk!
We hope that this would be a great opportunity to learn alongside the experts, explore the semiconductor industry, and network with notable professionals!
Invited talk
Session 2: Advanced Integration
Advanced Logic Process Technologies toward 2nm and Beyond
T. Yamamoto, Tokyo Electron Ltd.
Poster Session
October 12, 2023 (THU) 18:20-20:00
P-3 Graphene Deposition with High Power Pulsed Sputtering (HPPS) Plasma
Y. Ooishi1, A. Kuwada1, F. Maeda2, M. Shinohara3, S. Tanaka4, T. Matsumoto4
1 Fukuoka University,
2 Fukuoka Institute of Technology
3 Fukuoka University
4 Tokyo Electron Technology Solutions Co. Ltd.
P-4 Direct Deposition of Graphene on Si with High Power Pulsed Sputtering (HPPS) Plasma
Y. Ooishi1, A. Kuwada1, F. Maeda2, M. Shinohara3, S. Tanaka4, T. Matsumoto4
1 Fukuoka University
2 Fukuoka Institute of Technology
3 Fukuoka University
4 Tokyo Electron Technology Solutions Co. Ltd.
