Technical Committee on Silicon Device and Materials (SDM)
Event Summary
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Date
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2021.02.05 - 2021.02.05
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Location
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virtual conference
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Target
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Process Engineer
The February meeting of Technical Committee on Silicon Device and Materials (SDM) will be held virtually February 5th. The topics is "wiring and packaging, and related material technology". Tokyo Electron (TEL) will report on wiring technology required for semiconductor scaling.
InvitedRu Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect
H. Aizawa, K. Maekawa, K.H. Yu, G. Pattanaik, G. Leusink
TEL Technology Center, America, LLC
