IITC 2020
Event Summary
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Date
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2020.10.05 - 2020.10.09
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Location
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virtual conference
International Interconnect Technology Conference 2020(IITC2020) will be held as an online virtual conference, on October 5-9. The conference will focus on the interconnect technologies such as advanced metallization and 3D integration technologies for ULSI applications. Tokyo Electron (TEL) will have the honor of participating in three presentations.
For additional information, please visit the related link.
Wafer Surface Control for Ru Capping on Cu interconnect
H.Aizawa,K.Hung Yu,G.Pattanaik,K.Maekawa,G.Leusink (TEL Technology Center,America,LLC)
Enhanced Vertical Conductivity in Few-layer Graphene and Graphite with Transition Metal Intercalation: a Theoretical Study
Z.Ni,T.Matsumoto,R.Ifuku,M.Masaaki,M.Kazuyoshi (Tokyo Electron Technology Solutions Ltd.）
Plasma-induced roughness and chemical modifications of TiN bottom electrode and their impact on HfO2-MIM properties
S.Rogalskyj*1,2,H.Frost*1,2,A.Palka*1,N.Joy*1,D.Triyoso*1,R.Clark*1,C.Wajda*1,G.Leusink*1,A.Raley*1,K.Dunn*2
*1 TEL Technology Center, America, LLC
*2 College of Nanoscale Science & Engineering, SUNY Polytechnic Institute
