ALD/ALE2020
Event Summary
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Date
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2020.06.29 - 2020.07.01
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Location
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virtual conference
The AVS 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will be held June 29-July 1 via virtual conference. The conference highlights the science and technology of atomic layer deposition (ALD) and atomic layer etching (ALE).
Tokyo Electron (TEL) will report four research results, including one invited talk.
Invited talksSelective and Atomic-Scale Processes to Enable Future Nano-Electronics
Robert Clark (TEL Technology Center‚ America‚ LLC)
Oral presentations
Plasma Enhanced Spatial Atomic Layer Deposition of Silicon Nitride using Di (isopropylamino) silane and N2 plasma
Hisashi Higuchi *1, Steven Consiglio *1‚ Hiroyuki Suzuki *1‚ Cory Wajda *1‚ Gert Leusink *1 and David O’Meara*2
*1 TEL Technology Center‚ America‚ LLC
*2 Tokyo Electron America Inc.
Poster exhibitions
1. Infrared Spectroscopy of SiNx Grown by Atomic Layer Deposition on Structured Substrates
2. Low Temperature Thermal a-SiC Deposition Using Pulse CVD and ALD
1. Yuji Otsuki‚ Yusuke Suzuki‚ Munehito Kagaya‚ Kentaro Oshimo‚ Hiroki Murakami and Kenji Ouchi (Tokyo Electron Technology Solutions Limited)
2. Susumu Yamauchi*1‚ Makoto Fujikawa*1 and Takahiro Miyahara *2
*1 Tokyo Electron Technology Solutions Limited
*2 TEL Technology Center‚ America‚ LLC
