Advanced Packaging Stratus™ Series

Deliver cutting-edge electroplating technologies through optimized platform into the advanced packaging industry

Stratus™ series is a scalable platform using multiple electroplating cells which make it configurable for processes with long plating times (tall copper pillars), multi-metal stacks (copper pillars) and the production of multiple products at once (fan out packages including fine line RDL).

Stratus™ P300

The Stratus™ P300 is a fully automated electrodeposition system for processing 200mm or 300mm wafers. Designed specifically to satisfy the particular challenges of 3D integration and thick metal deposition for advanced packaging applications, the The Stratus™ system’s unique ShearPlate deposition module maximizes yield for high aspect ratio bumps while minimizing the cost of materials. With more plating positions than the competition the Stratus™ P300 provides superior on wafer results, with better uniformity, at faster plating speeds. Greater processing power helps chip manufacturers achieve better cost of ownership for longer plating applications, such as copper pillar, interposer and fan-out wafer level packaging. With several distinct chemistries in one system, an array of metals and multi-metal stacks can be plated. The P300 is the highest productivity tool in TELs advanced packaging ECD family. Advanced chemistry use is made possible by hardware features and reduces chemistry costs, prolongs bath stability and improves process repeatability over time. P300 has the ability to process more than 6 different metals on the same tool. With safer wafer handling of thin, thick, bowed, warped and carrier wafers, the P300 can process the increasing diversity of advanced packaging wafers. In the P300, wafers are secured once in a protective wafer holder before moving throughout the tool. As the front end merges with the back end of the line, more stringent plating specifications are emerging. Moore’s law can involve costly investments in design changes at the front end of the line that often result in more levels of build-up. Advanced packaging is making possible more affordable design innovations, but equipment must be capable of handling a broader range of wafer types and sizes to make those developments real in microelectronic products.

Stratus™ P500

Stratus™ P500s wafer level plating precision has been proven at cutting edge panel manufacturers worldwide. The system can handle substrates up to 510 x 515mm panels, including thin, thick and warped units. P500 is a scalable platform using multiple electroplating cells which make it configurable for processes with long plating times (tall copper pillars), multi-metal stacks (copper pillars) and the production of multiple products at once (fan out packages including fine line RDL). Plating roadmaps in advanced packaging are driving to the extremes, requiring faster more uniform filling of either smaller or larger topographical features. By expanding the substrate size, the P500 disrupts the semiconductor manufacturing industry and increases substrate area by up to four times compared to 300mm wafers. Stratus™ P500 is running at several customer sites. P500 has the ability to process up to 5 different metals on the same tool. The system has reservoirs that stabilize specific chemistries, these reservoirs reduce overall plating additive consumption and simplify maintenance. Since chemistry reservoirs are separated by rinse cells, the risk of cross contamination is minimized. Having rinse cells throughout the system means no choice has to be made between tool cleanliness and productivity because discrete rinse stations allow for high process cell utilization. ShearPlate agitation provides faster plating possiblity and better coplanarity when used with advanced plating chemistries. The Stratus™ P500 delivers the only solution on the market for wafer scale precision plating of panel substrates.

Stratus™ S300

Stratus™ S300 plating system is a workhorse for wafer bumping. Stratus™ S300 provides a range of electrochemical deposition processing for 200mm and 300mm wafers, as well as an array of substrate materials, such as thin silicon, glass, sapphire and compound semiconductors. For optimal production flexibility, the S300 boasts true bridge tool capability permitting two size of wafers to be processed at the same time. With features typified by membrane cell technology, the S300 can process advanced wafer chemistries, such as TSV and copper pillar while maintaining bath stability over time. It can be configured to plate up to six different metals. The S300 can be converted to produce different applications over time and can also be purchased for R&D and then extended for volume production at a later date when demand justifies investment. This ECD system has on board cleaning solutions available as well as chemical management features. Manufacturers have found the Stratus™ S300 ideal for volume production of multiple advanced packaging structures, fan out, Cu and Au RDL, copper pillars and WLCSP among others.

Stratus™ S200

Stratus™ S200 plating system can process a range of wafer sizes, 100/150/200mm wafers, as well as an array of substrate materials, such as thin silicon, glass, sapphire and compound semiconductors. For optimal production flexibility, the S200 boasts true bridge tool capability permitting two size of wafers to be processed at the same time. The S200 can be configured to plate up to six different metals, depending on the customer’s requirements. It can also be purchased for R&D and then extended for volume production at a later date when demand justifies investment. This ECD system has on board cleaning solutions available as well as chemical management features. Manufacturers have found the Stratus S200 ideal for volume production of RF devices, through via structures, Au RDL, copper pillars and WLCSP among other advanced packaging features.

Product comparison

Stratus™ P300Stratus™ P500Stratus™ S300Stratus™ S200
Wafer size (mm)200,300510×515, custom200,300100,150,200
Availability
(*subject to availability)
NewNewNew, Certified used*New, Certified used*
ProcessCu pillar, Fan out, RDL, Interposer, TSV
SubtratesSilicon, eWLB, Glass,
Bonded, Carrier
Panels: Glass,
Composite, Other

Silicon, eWLB, Glass,
Bonded, Carrier

Sillicon, eWLB, Glass, Bonded, Carrier,
Sapphire, Lithium tantalate,
Lithium nipbate, GaAs

FeaturesBridge tool, Membrane cells, Substrate
handling flexiblity
Membrane cells,
FOWLP performance

Bridge tool, Membrane cells, Substrate
handling flexiblity

Bridge tool, Substrate
handling flexiblity