Advanced Packaging Apollo Series

Delivers the highest performance and lowest cost thin film deposition solution for high volume, cutting-edge semiconductor advanced packaging market

TEL’s Apollo series is a unique in-line physical vapor deposition system offering the highest performance and lowest cost solution for thin film deposition needs. The system is a flexible bridge tool available as a fully automated solution for 100/150/200/300mm wafers or as a semi-automated manual front-end solution for square or round substrates from 2 inches to 12 inches. Apollo serves a wide range of applications from under bump metal, redistribution layer metal, RF filters, back side and front side metallization for power devices, LED contacts, CMOS image sensors and space-saving EMI shielding. The inline design of the Apollo enables unparalleled speed, flexibility and cost-effectiveness for all thin film metallization needs in the most compact footprint on the market.

Apollo UBM/RDL

Apollo UBM/RDL is an in-line physical vapor deposition system optimized for thin film deposition of seed layers for redistribution layers (RDL) and under bump metallization (UBM). With the highest performance at the lowest cost, Apollo UBM/RDL impacts the industry by bringing TEL’s product quality control and customer support experience to the far back end of the line. This solution brings the highest level of efficiency and flexibility to wafer level packaging with the capability to handle an array of bowed, warped and thin wafers at a variety of wafer thicknesses from under 40µm (Taiko) up to 2mm. The Apollo UBM/RDL is a bridge tool available as a fully automated, high throughput sputtering solution for 100/150/200/300mm wafers or as a semi-automated manual front-end solution for square or round substrates from 2inches to 12inches. Quick and simple wafer size change in less than one hour is possible. The system realizes easy configuration to meet R&D or high volume manufacturing needs with one to five metal targets in a single deposition chamber supporting deposition of up to 54 different metals. Process performance is exceptional, delivering minimal oxide regrowth between process steps for improved contact resistance across a large range of devices. The system serves a wide range of applications from under bump metal, redistribution layer metal, RF filters, back side and front side metallization for power devices to LED contacts, CMOS image sensors and EMI shielding. Wafers are safely handled in atmosphere: the system provides safe and flexible wafer handling for variety of delicate substrates such as ultra-thin and TAIKO, LN/LT, SiC, GaAs, glass, bonded etc. The Apollo UBM/RDL produces both thick and thin metal films in the most compact footprint on the market.

Apollo BSM

The Apollo Back-Side Metallization (BSM) has the flexibility for thick metal film deposition (0.5µm–10µm) to the opposite side of active wafer surface, or at the substrate level for device interconnects. The Apollo BSM is a high-throughput automated production solution to meet the market demand for smaller devices capable of dissipating increasing amounts of power on thinner wafers. The Apollo BSM is suitable especially for power device applications as trays protect fragile wafers, such as thin silicon, silicon carbide, GaN, and others. The movement toward larger wafer sizes is driving the industry to re-think existing back-side metallization (BSM) capabilities, and the Apollo’s extendibility can serve manufacturer’s needs today and in the future. The system also serves seed layers for customers who manufacture multiple advanced packaging features, likes a range of copper redistribution layers (RDL) and UBM, the maximum wafer size is 200mm.

Product comparison

Apollo UBM/RDLApollo BSM
Wafer size (mm)150-300100-200
Availability (*subject to availability)New, Certified used*New, Certified used*
ProcessTi/TiW-Cu, Other metalsTi/TiW-Cu, Ti/Al-Ni/NiV-Ag/Au,
Other metals
SubtratesSillicon, Fan-out, Glass, Bonding waferSillicon, Fan-out, Glass, Bonding wafer, Thin/TAIKO, GaAs, SiC, LiNb, LiTa
FeaturesBridge tool, Fagile & thin wafer process, Small footprint, In-line architecture, Degas/anneal, ICP/CCP etch, Up to 5 metals deposition, Temperature & stress control