Notification

Apr 25, 2018

Announcing New Building Construction

Tokyo Electron (TEL) announced today its decision to construct new manufacturing buildings at its subsidiary, Tokyo Electron Technology Solutions, with the purpose of expanding the production capacity for semiconductor manufacturing equipment in anticipation of a continued rise in semiconductor demand. The new buildings will be built at the subsidiary’s Yamanashi (Fujii) and Tohoku office sites. The market of deposition systems, which Tokyo Electron Technology Solutions develops and manufactures, is expected to grow substantially due to continued technological innovations. The construction of the new buildings will enable TEL to respond even more quickly to the demands of the market and customers, helping the company to attain sustainable medium- to long-term growth.

[Building Summary]

1. New building at Yamanashi (Fujii) Office

Total floor area: 32,455 ㎡

Structure: Steel frame structure with a base isolation system

Number of floors: 4 above ground

Construction start: January 2019 (scheduled); Completion: April 2020 (scheduled)

Construction cost: Approximately 13 billion yen

Purpose: Manufacture of single-wafer deposition systems, gas chemical etch systems, and test systems

2. New building at Tohoku Office

Total floor area: 31,777 ㎡

Structure: Steel frame structure with a base isolation system

Number of floors: 4 above ground

Construction start: October 2018; Completion: September 2019 (end of 1st phase*), December 2020 (end of 2nd phase)
*Part of manufacturing building

Construction cost: Approximately 13 billion yen

Purpose: Manufacture of thermal processing systems

[Business Profile of Tokyo Electron Technology Solutions]

Established in July 2017 through the merger of Tokyo Electron Yamanashi and Tokyo Electron Tohoku.

Number of employees: 4,618 (including those of associated company) as of April 1, 2018

Address: 2381-1 Kitagejo, Fujii-cho, Nirasaki City, Yamanashi

Line of business: Development and manufacturing of thermal processing system, single-wafer deposition system, gas chemical etch system, test system, and FPD plasma etch/ash system

Completion image of new building at Yamanashi office

20180425_YamanashiOffice.jpg


Completion image of new building at Tohoku office

20180425_TohokuOffice.jpg