
When wafers first arrive in a cleanroom, or after they have completed a process cycle, they undergo a cleaning procedure to remove foreign particles and/or contamination. Surface preparation systems use one of several methods to eliminate particles, such as brushes or sprays, depending on the type of cleaning required.
Auto Wet Station
EXPEDIUS +
Auto Wet Station
EXPEDIUS -i
Gas Chemical Etch System
Certas WING
Single Wafer Cleaning System
CELLESTA +
Single Wafer Cleaning System
CELLESTA -i
Scrubber System
NS300+ HT
Scrubber System
NS300+
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