Tokyo Electron Limited (TEL) today announced that TEL and the Institute of Microelectronics in Singapore ("IME"; Executive Director: Professor Dim-Lee Kwong) reached an agreement to establish, and begin joint research at, a Joint Assembly Lab in Singapore. Since establishment in Singapore in 2012, the TEL wholly owned subsidiary Tokyo Electron Singapore Pte. Ltd. has been conducting joint research into advanced lithography. The Joint Assembly Lab announced today will help accelerate research and development into the field of wafer level packaging and assembly.
As part of realizing the feasibility of the Internet of Things (IoT) society, there are increasing demands for greater miniaturization and longer battery life for mobile and other devices. In addition to high-performance, low power consumption compact devices, increasing volumes of data are resulting in an increase in demand for servers able to achieve high-performance, rapid processing of data. However, there is a limit to the number of inputs/outputs (I/Os) and reductions in power consumption that can be achieved when interconnecting devices using the current wire-based methods. Important initiatives, among the technological innovations that will improve lifestyles into the future, are shrinking the devices themselves, plus performance enhancements and reductions in power consumption achieved through 2.5D and 3D wafer level packaging.
The Joint Assembly Lab will house joint research and development related to room-temperature wafer bonding (and debonding) by means of a temporary bonding glue, permanent wafer bonding, batch bonding of fine pitch chip-on-wafer, and highly accurate Insitu aligning metal bonding, all of which will be required for 2.5D and 3D devices going forward.
Even though R&D-level prototyping and pilot-line production in the 2.5D and 3D segments has been possible in the past, rollout of full-scale mass production has always needed solutions for cost issues. Using advanced analysis and research technologies plus evaluation samples taking advantage of IME' s TSV device technology, TEL and IME aim to achieve substantial running cost reductions and establish industry-standard technologies in the development of processes for room-temperature temporary bonding and debonding, and low temperature Cu-Cu hybrid bonding.
The collaboration will also include joint development of systems that enable batch bonding of fine pitch chip-on-wafer, and highly accurate Insitu aligning metal bonding. Through this, the companies will contribute to the realization of low cost-of-ownership (CoO) and widespread application of 2.5D and 3D devices to mobile and other general-purpose devices.