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Semiconductor Production Equipment

UNITY-EP

UNITY-EP

UNITY EP´Â,High Step Coverage,»õ·Î¿îCapacitor Àç·á ä¿ëÀ̶ó´Â »õ·Î¿î Device Need¿¡ ´ëÀÀÇÑ Single Wafer CVDÀåºñÀÔ´Ï´Ù. ´õ¿íÀÌ ¾ç»ê½ÇÀûÀÌ ÀÖ´Â UNITY CVD Process¸¦ °è½ÂÇϰí Maintenance¿Í SpaceÈ¿À²À» °³¼±ÇÏ¿© »ý»ê¼º Çâ»óÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù. ÁÖ¿ä Æ¯Â¡Àº Trap ¹× Controller°èÀÇ ¼ÒÇüÈ­¿¡ ÀÇÇØ Foot Print»è°¨, »õ·Î¿î ConceptÀ» ±âÃÊ·ÎÇÑ Heater¿Âµµ Control¿¡ ÀÇÇÑ Process¾ÈÁ¤È­ Çâ»óÀÔ´Ï´Ù.
Dry Cleaning¿¡ °üÇØ¼­´Â ,MB2-730, UNITY CVDÀåºñ¿¡¼­ È£ÆòÀ» ¹ÞÀº Plasma Less CleaningÀ» °è¼ÓÇÏ¿© ä¿ëÇÏ¿© , ³·ÀºParticle °ú Maintenance Cycle¿¬ÀåÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

  • Wafer Size : 6 Inch - 8 Inch
  • Process Module : 1-4 Chamber
  • Wafer ³Ã°¢ Module : 1-2 °³
  • ´ëÀÀ Process : Precleaning,Ti,TiN
  • Plasma Less Cleaning
  • ¡ØUNITY´Â, µ¿°æ¿¤·ºÆ®·Ð ÁÖ½Äȸ»çÀÇ »óÇ¥ÀÔ´Ï´Ù.

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