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Semiconductor Production Equipment

UNITY

UNITY

200mm Wafer»ý»êLine¿¡¼­ 130nmÀÌÈÄ ¼¼´ëÀÇ ¶Ù¾î³­ Cost Performance¸¦ ½ÇÇöÇÏ´Â EtchingÀåÄ¡ÀÔ´Ï´Ù. UNITY¿¡´Â IIe, MeÀÇ VersionÀÌ ÀÖ°í, ¶Ù¾î³­ »ý»ê¼º°ú ³ôÀº ½Å·Ú¼ºÀ» ´Þ¼ºÇϰí ÀÖ½À´Ï´Ù.
UNITY´Â °¢Á¾ Chamber ApplicationÀ» žÀçÇÏ´Â °ÍÀ¸·Î¼­ Contact, Dual Damascene, Low-KÀý¿¬¸·, Poly Gate, Shallow Trenchµî Æø ³ÐÀº Process¿µ¿ª¿¡ ´ëÀÀµÇ¸ç ¾÷°è Top LevelÀÇ °í»ý»ê¼ºÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù.

  • PE(IIe), IEM(IIe), DRM, SCCM Plasma SourceÀÇ Å¾Àç°¡´É
  • ÃÖ´ë 4Chamber ´ëÀÀ°¡´É(Me)
  • °íThrough-Put, Compact Design, ÀúCoO´Þ¼º
  • ¶Ù¾î³­ Maintenance¼º
  • Flow Control SystemÀÇ Å¾Àç°¡´É(Me)
  • UNITY´Â 84, 85, 88 ModelÀÌ ÀÖ½À´Ï´Ù.
  • *UNITY´Â, µ¿°æ¿¤·ºÆ®·Ð ÁÖ½Äȸ»çÀÇ »óÇ¥ÀÔ´Ï´Ù.
  • *SCCMÀº, µ¿°æ¿¤·ºÆ®·Ð ÁÖ½Äȸ»çÀÇ »óÇ¥ÀÔ´Ï´Ù.

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