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Telius

Telius

Telius´Â ´ëÇüÈ­(300mm) ¿ä±¸¿¡ ´ëÀÀÇØ¼­ ³ôÀº Cost Performance¸¦ ½ÇÇöÇÑ ÃÖ½ÅÇü EtchingÀåÄ¡ÀÔ´Ï´Ù. º¸´Ù ³ªÀº »ý»ê¼ºÇâ»óÀ» ¸ñÀûÀ¸·Î ÇÑ SP VersionÀº TeliusÀÇ Platform Concept¿¡¼­ Through PutÇâ»ó, Foot-PrintÀú°¨, ¿¡³ÊÁö Àý¾àÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù.
Telius´Â °¢Á¾ Chamber ApplicationÀ» žÀçÇÏ´Â °ÍÀ¸·Î¼­ Contact, Dual Damascene, Low-KÀý¿¬¸·, Poly Gate, Shallow Trenchµî Æø ³ÐÀº Process¿µ¿ª¿¡ ´ëÀÀµÇ¸ç ¾÷°è Top LevelÀÇ °í»ý»ê¼ºÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù.

  • DRM, SCCM® Plasma SourceÀÇ Å¾Àç°¡´É
  • ÃÖ´ë 4Chamber ´ëÀÀ°¡´É(»çÁøÀº 2Chamber System)
  • ÀÚÀ¯µµ°¡ ³ôÀº SystemÈ®À强
  • 200mmÀåÄ¡¿Í µ¿ÀÏ Clean RoomÀüÀ¯¸éÀûÀÇ ´Þ¼º
  • °íThrough-Put, Compact Design, ÀúCoO´Þ¼º
  • ¶Ù¾î³­ Maintenance¼º
  • Telius´Â 304, 305, 308 ModelÀÌ ÀÖ½À´Ï´Ù.
  • ¡ØTelius´Â, µ¿°æ¿¤·ºÆ®·Ð ÁÖ½Äȸ»çÀÇ »óÇ¥ÀÔ´Ï´Ù.
  • ¡ØSCCMÀº, µ¿°æ¿¤·ºÆ®·Ð ÁÖ½Äȸ»çÀÇ »óÇ¥ÀÔ´Ï´Ù.

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