Etch Systems
µ¿°æ ¿¤·ºÆ®·ÐÀÇ EtchingÀåÄ¡´Â SAC(Self Aligned Contact), Dual Damascene, Low-kÀÇ Àý¿¬¸·, Poly Gate, Silicon Deep TrenchµîÀÇ ³ÐÀº Plasma EtchingÀÇ Application ¿µ¿ª¿¡¼ÀÇ »ç¿ëÀÌ °¡´ÉÇÏ¿©, ³ôÀº Performance¿Í Chamber¸¶´ÙÀÇ ³ôÀº ÀçÇö¼º¿¡ ÀÇÇØ ¼¼°è½ÃÀå¿¡¼ ³ô°Ô Æò°¡¸¦ ¾ò°í ÀÖ½À´Ï´Ù.
EtchingÀåÄ¡¶õ?
|
Coater/Developer¿¡ ÀÇÇØ Çö»óµÈ Wafer»ó¿¡¼´Â Photoresist¿¡ ÀÇÇÑ È¸·ÎÆÐÅÏÀÌ ±×·ÁÁ® ÀÖ¾î, EtchingÀåÄ¡ÀÇ Chamber Áß¿¡¼, Plasma »óŰ¡ µÈ Etching Gas°¡ »êȸ· µîÀÇ ¹Ú¸·À» Pattern¿¡ µû¶ó Áö¿ö³À´Ï´Ù.
|
 |
 |
|

|
|
|
Back to top
|