CLEAN TRACK ACT 8/12 SOD
º» ÀåÄ¡´Â ÀúÀ¯ÀüÀ² Àý¿¬¸·(Low-k dielectrics) Çü¼ºProcess¿¡ ´ëÇØ, Low-kÀç·áÀÇ µµÆ÷, °ÇÁ¶, BakeµîÀÇ ÀÏȯ 󸮸¦ ÇÏ´Â SOD(Spin on Dielectric)µµÆ÷¼º¸·ÀåÄ¡ÀÔ´Ï´Ù.
ÀúÀ¯ÀüÀ²Àý¿¬¸·(Low-k)ÀÌ µÇ´Â SODÀç·áÀÇ µµÆ÷, °ÇÁ¶, BakeµîÀÌ °¡´ÉÇÕ´Ï´Ù.
¶Ç, Resist coater/ developer ·Î¼ ³ôÀº ÃâÇϽÇÀûÀ» °¡Áø CLEAN TRACK ACT ½Ã¸®ÁîÀÇ PlatformÀ» ä¿ëÇÔ¿¡ µû¶ó, °í¼Ó¹ÝÀÀ°ú ¼ºSpace¿Í ´õºÒ¾î ³ôÀº »ý»ê¼º°ú ½Å·Ú¼ºÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù.
°¢Á¾ SODÀç·á(À¯±â.¹«±â.Hybrid,Porous¸· µî)ÀÇ ´ëÀÀ¿¡ ´ëÇØ¼´Â µ¶ÀÚÀÇ Unit¿¡ ÀÇÇÑ ÃÖÀûȸ¦ ÀÌ·ê ¼ö ÀÖ½À´Ï´Ù.
´õ¿íÀÌ Àú»ê¼Ò³óµµ ºÐÀ§±â¿¡ °í¿Â󸮰¡ µÇ´Â Hot plate¸¦ žÀçÇØ, Á¾·¡ÀÇ Furnace·Î 󸮵Ǿú´ø Cureµµ ÀåÄ¡³»·Î ½ÇÇö°¡´ÉÇÕ´Ï´Ù.
- High productivity
- High throughput
- Compact footprint
- Low oxygen bake and cure capability
- Verification of oxygen control by lot
- Single wafer, in-line cure process
- SMIF capability
- ¡ØCLEAN TRACK ¹× CLEAN TRACK ACT´Â µ¿°æ¿¤·ºÆ®·Ð ÁÖ½Äȸ»çÀÇ »óÇ¥ÀÔ´Ï´Ù.
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