The WDF DP offers the dual functionality of a wafer prober and a dicing frame handler, and is specifically designed for CSP/WLCSPs, fast growing market. A unique design enables the WDF DP to handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvements. The WDF DP also helps reduce test costs by allowing functionality to be switched without a change-over-kit and providing a faster index time compared to conventional handlers.

• Standard 5, 6 & 8 inch wafers
• Diced wafers (4, 5, 6, 8 inch diced)
• Wafer Level Packages (WLPs)
• Ultra thin wafer (4, 5, 6, 8 inch)

• Wafer and dicing frame handling capability without a change-over-kit
• Over twice the throughput of conventional horizontally moving handler
• Special alignment available for diced wafers
• Hot temperature testing (max :150�Ž)
• Flat-top for large test-head support

• *WDF is a registered trademark of Tokyo Electron Limited in Japan and other countries