Based on TEL's production-proven WDF DP system, the WDF 12DP also benefits from the advanced hardware reliability of TEL's 300mm Precio series of fully automatic wafer probers. Employing TEL's patented On-Axis Alignment and N-Shot alignment feature, the WDF 12DP provides superior accuracy and the ability to test in parallel.

• 300mm Standard wafers
• Diameter 400mm Dicing Frame (DF)
• 200/300mm WLP (Wafer Level Package) on DF
• 200/300mm Ultra thin wafer on DF

• Capable of testing both before and after dicing for ultra thin wafer and WLP on dicing frame
• Special N-shot alignment available for high accuracy contact of diced wafers
• Switch between standard wafer and dicing frame handing capability without a change kit
• Avoids device jams with smooth handling design for dicing frames

• *WDF is a registered trademark of Tokyo Electron Limited in Japan and other countries.