Precio was designed to lower overall test cell operating costs while providing maximum flexibility for these demanding market requirements. Precio contributes to lower operating costs beyond the prober in areas such as tooling and probe card costs, labor, spares, and overhead. Precio maintains XY contact accuracy while enabling precision Z contact accuracy and control to stabilize contact resistance. It offers a new patented option for improved planarity between the chuck top and probe card, a critical requirement for optimized testing in high multisite and full wafer testing applications. Precio also offers inline high speed probe mark inspection capability, TELPADSTM-I, to drastically improve inspection functionality and throughput.

• Small Die and Fine Pitch probing
• Low-noise parametric probing
• High pin count and High multi-site SOC and Memory
• Full Wafer testing

• High productivity
• Small footprint
• High reliability
• Better Contact / Better Yield
• Short Lead Time
• TELPADSTM-I (Option)
• Auto leveling (Option)
• Zoom-1�iOption�j

• *Precio and TELPADS are registered trademark or trademark of Tokyo Electron Limited in Japan and other countries.