The P-8XL prober series provide the optimum probing environment for 100, 150 and 200mm wafer testing. Based on TEL's On-Axis Alignment System, the P-8XL series satisfies the needs of multi-DUT memory devices and high-speed multi-pin logic devices. This is achieved through an expanded Automatic Set-Up�iASU�jcard alignment area and a rigid Z stage. The P-8XLm incorporates technology advancements from TEL's market leading P-12XL 300mm wafer prober to improve accuracy. A new, high rigidity Z stage can handle higher pin count probe cards with less horizontal and vertical deflection. Additionally a new optics system improves alignment of fine pitch probes and allows for the P-8XLm to address applications with tighter design rules.

• Analog, Linear, Power & Low End Logic Devices
• DC Parametric, Fine Pitch ASICs, Memory
• VLSI devices, SOC, LCD drivers, other high-end devices
• Multi-DUT�ihigh parallel device count�j

• Rigid XYZ stage with high accuracy
• High accuracy on-axis alignment
• Fully Integrated High and Low Temperature Thermal Systems
• PC-aided product file management and remote operation
• TRX chuck top for low leakage current
• Software compatibility with TEL's other P-8 series