TEL's wafer probe solutions are designed to improve test flow cost-of-ownership through innovations that address the key elements of the test process: capital investment, tooling, labor, overhead and reliability.

With the largest market share of fully automatic wafer probers worldwide, TEL's Test Systems Business Unit has a history of leading the market in technological advancement. As a testament to our quality workmanship and dedication to equipment reliability, TEL's first-generation probers are still in production today.

Wafer Probing is one of the final steps in the semiconductor manufacturing process where the completed device is measured. Prior to being separated from the wafer and packaged for its final application, each die (chip) on the wafer is tested to determine its functionality and/or performance. This process is sometimes known as wafer sort or electronic sort.

The wafer prober is responsible for bringing the wafer in contact with tiny probes (or needles) where the die are electrically stimulated or tested. Wafer probers must ensure XYZ mechanical accuracy and include optics for performing alignment between the probes and the contact pads of each die (bond pads).