Optical Digital Profilometry (ODP) technology, developed by Timbre Technologies, provides the capability to produce accurate and precise models, which are the key enablers for production use of scatterometry results for both stand-alone and integrated metrology (IM) applications. Timbre's ODP products are used in production at leading memory and logic device manufacturers around the world. It provides customers with the best data integrity, while having the largest application space and the fastest production implementation.

Metrology is a technology priority to TEL in both our 200mm and 300mm products. Therefore, TEL has used the ODP technology to enable integrated metrology for lithography, etch, and CMP systems.

ODP (Optical Digital Profilometry) is an industry-leading non-destructive metrology technology that utilizes optical instruments based on spectroscopic ellipsometry or reflectometry to precisely measure critical dimensions (CDs), sidewall angles, and multiple layer film thicknesses. These measurements can be made on both 2D line/space structures, as well as 3D hole or island structures. The process is executed in-line, which eliminates the need to break the wafer for performing the analyses.