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TELINDY/TELINDY PLUS

TELINDY

The TELINDY 300mm wafer processing platform draws from the advantages of both the TELFORMULA and ALPHA(α)-303i platforms to address the emerging trends and demands of high-volume thermal processing for sub-45nm technology. TELINDY provides a 125 wafer batch size, high speed robotics, and other improvements for cost-effectively processing many different oxidation and deposited films. The latest platform, TELINDY PLUS, enables even higher productivity and performance improvements through the implementation of new robotics units and a newly-designed furnace main-frame.

Applications

  • General oxidation / Anneal
  • Radical oxidation
  • LPCVD films
  • Ultra low temperature LPCVD applications
  • High-k dielectrics

Features

  • 2FIMS*
  • Reduced N2 consumption*
  • Reduced footprint - less maintenance space required*
  • Newly designed anti-earthquake measures for 2-boat operation*
  • In-situ dry gas cleaning technology
  • Fast ramp up and cool down heater
  • High speed robotics
  • Large 125-wafer load size
*TELINDY PLUS

  • *TELINDY is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.
  • *TELINDY PLUS is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.

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