TELFORMULA is an advanced thermal processing system for 300mm wafers capable of handling a wide range of oxidation and low pressure chemical vapor deposition(LPCVD) processes for advanced nano-scale technology for 65nm node generation device production and beyond. With a fast thermal response heater, in-situ cleaning, and many more enabling technologies for short cycle time, TELFORMULA is flexible for development and cost efficient for high-volume manufacturing.

• Radical oxidation
• Ultra thin gate dielectrics formation
• LPCVD Poly, Oxide and Nitride
• High-k dielectrics

• Ultra clean, all quartz reactor
• State-of-the-art heater element technology
• High speed wafer transfer robotics
• In-situ dry gas cleaning technology

• *TELFORMULA is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.