The NS300+ wafer scrubber system enables 300mm process yield enhancement by using physical force and chemical action to remove defects from the top side, back side and bevel area of the wafer. Defect removal techniques include brush cleaning, atomized spray and dilute chemical rinsing. The NS300+ is an 8-chamber tool that offers twice the throughput of TEL's previous 4-chamber model while maintaining a comparable footprint. Employing TEL's market-leading coater/developer Lithius Pro platform technology, the NS300+ offers a highly reliable wafer processing platform and Ingenio for process, hardware and maintenance data monitoring and reporting. The established yield enhancement performance from the previous model has been enhanced with the new bevel cleaning function and upgrades to the existing brush and atomized spray technology used to clean the front and back side of the wafer.

NS300+ is both competitive for cost of ownership and environmental impact. NS300+ has high throughput, a small footprint and high reliability while consuming 42% less water and 51% less electrical power.

• Front and back side wafer scrubber
• Wafer bevel cleaner

• High throughput scrubber platform utilizing eight process chambers
• Comparable footprint to previous four chamber model (TEL NS300)
• New bevel brush and chemical function to complement the existing front/back brush and atomized spray functions of NS300
• Reliable wafer transfer system and upgraded data collection software Ingenio based on CLEAN TRACK LITHIUS Pro
• Carbon footprint of NS300+ is 18% lower than previous model

• *CLEAN TRACK LITHIUS Pro is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.
• *Ingenio is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.