The EXPEDIUS+ is designed specifically for leading edge FEOL cleans, etch, and resist strip for 300mm high volume manufacturing of advanced 45nm technologies and beyond. Offering a 20% footprint reduction, the robust system achieves superior productivity by minimizing wafer handling time with a capability of handling up to 600 wafers per hour. This optimized throughput combined with a smaller footprint enables users to achieve best-in-class performance and cost-of-ownership.

• Pre-diffusion / pre-gate cleans
• Oxide etch
• Resist strip / organics removal
• Wafer reclaim
• Nitride strip

• Cassette-less wafer transport with 50-wafer batch size and narrow pitch processing
• Low CoO as a result of reduced DIW, chemical, and exhaust requirements
• Design standardization for reduced delivery interval, installation time, and inventory requirements
• Multiple chemistry processing in a single point of use bath
• Stacked dual chamber dryer (SD2) with in-situ chemical injection for process flexibility and watermark-less drying performance
• Flexible processing, through point-of-use or recirculation bath designs

• *EXPEDIUS is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.